Selective Electronic Element Transfer for Higher Yield Assembly
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Solution Overview
Problem
The yield rate of electronic devices decreases with the miniaturization of electronic elements due to inefficiencies in the transfer process during manufacturing.
Innovation Solution
A method involving inspection and selective transfer of normal electronic elements from a first substrate to a second substrate, while leaving defective elements behind, using techniques like laser transfer and alignment processes to enhance precision and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic elements are transferred using a transfer process to enhance manufacturing speed, then productivity is improved, but manufacturing precision deteriorates as the size of electronic elements is decreased
Solution Approach 1:
The patent applies preliminary action by performing inspection of electronic elements before the transfer process. The inspection unit detects defective elements in advance, and the control unit uses this information to selectively transfer only normal elements, thereby preventing defective elements from being transferred and improving yield rate while maintaining manufacturing speed
Solution Approach 2:
The patent implements feedback by using inspection results to control the transfer process. The control unit receives inspection data about each electronic element's status and adjusts the transfer process accordingly, selectively transferring only normal elements based on real-time feedback from the inspection unit
2Adaptability or versatility
If the size of electronic elements is decreased for miniaturization, then adaptability is improved, but manufacturing precision deteriorates due to reduced yield rate
Solution Approach 1:
The patent replaces mechanical transfer processes with a more precise system that combines inspection technology and selective transfer mechanisms. This substitution enables accurate identification and handling of miniaturized elements, maintaining yield rate despite the reduced size of electronic elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the yield rate of electronic devices by ensuring only functional elements are transferred, reducing defects and enhancing the overall manufacturing process efficiency.
Implementation Method 1
selective transferring the first normal electronic element from the first substrate to a first location of a second substrate
Implementation Method 2
separating the first normal electronic element from the first substrate
Data Source
AI summary
A method of manufacturing an electronic device includes: providing a first substrate with a plurality of electronic elements disposed thereon; inspecting at least part of the plurality of electronic elements on the first substrate to identify a first defective electronic element and a first normal electronic element; selectively transferring the first normal electronic element from the first substrate to a first location of a second substrate; and transferring a second normal electronic element to a second location of the second substrate corresponding to a location of the first defective electronic element on the first substrate.