Dual-Board Electronic Module Layout for Two-Sided Heat Dissipation
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Solution Overview
Problem
Conventional electronic modules struggle with inadequate heat radiation properties, especially with the advent of advanced semiconductor materials like SiC and GaN, and face challenges in manufacturing modules with multiple boards without resin adhesion to heat radiation surfaces.
Innovation Solution
An electronic module design featuring a first and second board with a support member in between, allowing heat radiation from both surfaces, and a manufacturing method that applies pressing forces to ensure close contact with a molding die to prevent resin adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional single-board electronic module is used, then the structure is simple and easy to manufacture, but the heat radiation property is insufficient
Solution Approach 1:
The electronic module is divided into two separate boards (first board and second board) with heat generation parts distributed on each. This segmentation allows heat to be radiated from both surfaces of the module, effectively doubling the heat radiation area and improving thermal management compared to a single-board design.
Solution Approach 2:
The invention transitions from a single-board planar structure to a dual-board three-dimensional structure where boards are disposed at different positions and orientations. This dimensional change enables heat radiation from both the top and bottom surfaces of the module, utilizing spatial distribution to enhance thermal performance.
2Ease of manufacture
If support pins are used to press constitutional elements in conventional molding, then resin adhesion to heat radiation surface is prevented, but this method cannot be applied when boards exist on both surfaces
Solution Approach 1:
A support member is introduced as an intermediary element between the first board and second board. This support member extends through the molding die and provides a pressing surface that allows the molding die to press the heat radiation surfaces of both boards without requiring direct access to constitutional elements, thus preventing resin adhesion while accommodating the dual-board structure.
Solution Approach 2:
Instead of pressing constitutional elements that protrude from the board (conventional method), the invention inverts the approach by pressing the heat radiation surfaces of the boards directly through the support member. This reversal of the pressing mechanism enables the molding process to work effectively with boards on both surfaces.
3Temperature
If boards are disposed on both surfaces for enhanced heat radiation, then heat radiation property is improved, but manufacturing complexity increases due to inability to use conventional support pin method
Solution Approach 1:
The support member serves multiple functions: it acts as a structural support between the two boards, provides a pressing surface for the molding die to prevent resin adhesion, and enables the molding process to accommodate the dual-board configuration. This multi-functionality simplifies the overall manufacturing process despite the complex dual-board structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat radiation properties and prevents resin adhesion, offering improved thermal management and manufacturing efficiency.
Implementation Method 1
a pressing force is applied to a back surface of a portion to which the first board and the support member are brought into contact and a back surface of a portion to which the second board and the support member are brought into contact, thereby bringing a heat radiation surface of the first board and a heat radiation surface of the second board into close contact with a molding die, so as to prevent adhesion of a resin to be molded
Data Source
AI summary
An electronic module includes a first board, a first heat generation part and a mold resin. The electronic module further includes a second board, and support members. A first heat radiation surface of the first board and a second heat radiation surface of the second board are exposed to an outside of the electronic module. According to such an electronic module, the electronic module can radiate heat from both surfaces of the electronic module and hence, it is possible to provide the electronic module that can increase heat radiation property compared to the conventional electronic module. Further, in manufacturing the electronic module, a pressing force can be applied to sides opposite to portions where the first and second boards are brought into contact with the support members and hence, the first heat radiation surface and the second heat radiation surface can be brought into close contact with a molding die.