Solder-Bonded Conductive Structure Using MXene Particles
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Solution Overview
Problem
Existing methods for solder bonding in electronic components face issues such as metallization dissolution, increased cost, and reduced conductivity due to the use of techniques like nickel plating and thick film methods, which also lead to high conductor resistance and repulsion of solder material.
Innovation Solution
A bonded structure comprising conductive members with MXene and MAX particles that inhibit metallization dissolution during soldering, maintaining high conductivity by using a layered material with specific metal and particle configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If nickel plating is used as a barrier layer to prevent metallization dissolution, then dissolution prevention is improved, but manufacturing cost increases and adhesion strength decreases due to chemical pretreatment
Solution Approach 1:
The patent uses a sacrificial oxide layer (SnO2, ZnO, or In2O3) that is intentionally designed to be consumed during soldering to prevent metallization dissolution. This disposable barrier layer approach replaces expensive nickel plating while maintaining protection function through a cost-effective oxide material that serves its purpose and is then removed or transformed during the soldering process.
Solution Approach 2:
The patent changes the chemical state of the barrier layer from metallic nickel requiring chemical pretreatment to metal oxides (SnO2, ZnO, In2O3) that can be directly applied without aggressive chemical treatment. This parameter change from metallic to oxidized state eliminates the need for acid/alkali pretreatment while maintaining barrier functionality.
2Reliability
If silver/palladium conductor with glass frit is used, then dissolution prevention is improved, but conductor resistance increases and solder material is repelled
Solution Approach 1:
The patent changes the composition parameters of the conductive paste by replacing or reducing glass frit content with metal oxide particles (SnO2, ZnO, In2O3). This parameter change reduces the insulating glass content that causes resistance and solder repulsion, while the metal oxide particles provide both conductivity and dissolution prevention functionality.
Solution Approach 2:
The patent creates a composite conductive material combining metal particles (silver, copper, or their alloys) with metal oxide particles (SnO2, ZnO, In2O3). This composite structure provides both the conductivity needed for electrical function and the dissolution prevention capability, eliminating the need for separate barrier layers and reducing overall resistance compared to glass frit-containing formulations.
3Reliability
If thick film method with multiple additives is used, then dissolution prevention is improved, but the number of manufacturing steps increases
Solution Approach 1:
The patent merges multiple functions into a single conductive paste formulation: conductivity (from metal particles), dissolution prevention (from metal oxide particles), and solderability. This consolidation eliminates the need for separate barrier layer formation steps and reduces the number of manufacturing operations compared to traditional thick film methods requiring multiple additives and post-fire processing.
Solution Approach 2:
The patent extracts and removes harmful or unnecessary components from the traditional thick film formulation, specifically eliminating glass frit and reducing the number of oxide additives. This extraction simplifies the material composition to essential metal and metal oxide particles, reducing manufacturing complexity while maintaining or improving performance.
Data Source
AI summary
A bonded structure that includes: a first conductive member; a second conductive member; and a solder-bonded part for bonding the first conductive member and the second conductive member, wherein at least one of the first conductive member and the second conductive member includes a metal and particles including one or more layers.