Substrate Recess Die Overhang Layout for Compact RF Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronics packages for RF applications have large lateral extensions due to high filter density, necessitating a need for alternative solutions to reduce footprint.
Innovation Solution
The implementation of a substrate with a recess and die configurations where a first die is mounted in the recess and a second die forms an overhang over the first die, potentially with additional dies forming overhangs or interconnected by wirebonds, reducing lateral extension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more filter components and circuitry components are mounted on the substrate to increase filter density, then the functionality and performance of the RF electronics package is improved, but the lateral extensions of the package become quite large
Solution Approach 1:
The patent transitions from a two-dimensional planar mounting arrangement to a three-dimensional vertical stacking configuration. Circuitry components are mounted on the opposite side of the substrate, creating vertical interconnections that reduce lateral footprint while maintaining component density. The recess structure further enables vertical integration by allowing components to be positioned at different height levels.
Solution Approach 2:
The recess formed in the substrate creates a nested structure where circuitry components can be positioned within the recess area, effectively utilizing the vertical space. This nesting approach allows multiple components to occupy overlapping lateral projections while being separated vertically, thereby reducing the overall lateral footprint of the package.
2Area of stationary object
If circuitry components are placed on the opposite side of the substrate to reduce footprint, then the lateral extensions are reduced, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The substrate is segmented into different functional zones including a recess area and mounting areas on opposite sides. This segmentation allows independent optimization of each zone - the recess can be designed for specific component types while the opposite side accommodates other components, simplifying the overall assembly process despite the three-dimensional arrangement.
Solution Approach 2:
The recess structure acts as an intermediary element that facilitates vertical integration. It provides a transition zone that enables mechanical and electrical interconnections between components on opposite sides of the substrate, managing the structural complexity through a dedicated intermediate feature rather than requiring complex external interconnection structures.
3Area of stationary object
If a recess is formed in the substrate and dies are mounted in overhang configurations to minimize lateral footprint, then the package size is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The recess is formed in the substrate before die mounting, establishing a pre-defined geometric reference structure. This preliminary action creates fixed lateral boundaries that guide the positioning of overhanging dies, reducing the actual positioning tolerance required during the die mounting process itself.
Solution Approach 2:
The overhanging die configuration utilizes the recess structure to self-align and self-support the die during mounting. The recess provides mechanical constraints that automatically position the die laterally, reducing the need for high-precision external positioning systems and lowering manufacturing precision requirements.
Data Source
AI summary
An electronics package has a recess formed in the top surface of a substrate, with a first die mounted on a bottom surface of the recess, and a second die mounted on the top surface of the substrate adjacent to the recess so that at least a portion of the second die forms an overhang over the first die