Substrate Socket Wiring Layout for Low-Loss Component Mounting
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Solution Overview
Problem
Existing electronic component mounting configurations face challenges in reducing energy loss in power supply wirings while maintaining a large mounting area for substrates.
Innovation Solution
The proposed solution involves a structure with power supply and signal wirings that penetrate a socket in the thickness direction of the main substrate, allowing for efficient electrical connections and reducing energy loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the width of the power supply wiring is increased to suppress energy loss, then the energy loss is reduced, but the area of the substrate surface that can be used for component mounting further decreases
Solution Approach 1:
The patent transitions the power supply wiring from a two-dimensional surface layout to a three-dimensional configuration by having the wiring penetrate the substrate thickness direction. This allows the wiring to pass through the substrate rather than occupying surface area, effectively moving the wiring problem from the surface plane to the depth dimension, thereby resolving the contradiction between reducing energy loss and maintaining mounting area.
Solution Approach 2:
The power supply wiring is nested within the substrate structure by penetrating through it. The wiring passes through holes or channels formed in the substrate, embedding the conductive path within the substrate's thickness rather than placing it on the surface. This nesting approach allows the wiring to coexist with the mounting surface without occupying valuable surface area.
2Loss of energy
If the width of the power supply wiring is increased to reduce energy loss, then the energy loss is reduced, but the power supply wiring occupies more substrate surface area
Solution Approach 1:
The power supply wiring is moved from the two-dimensional surface plane to the three-dimensional space by penetrating through the substrate thickness. This dimensional transition eliminates the need for wide surface traces, as the wiring now occupies volume rather than surface area, simultaneously reducing energy loss without increasing surface occupation.
Solution Approach 2:
The power supply wiring is extracted from the substrate surface and relocated to pass through the substrate interior. By taking the wiring out of the surface plane and embedding it within the substrate structure, the surface area occupied by the wiring is minimized while the wiring's electrical function is maintained through the thickness direction.
Data Source
AI summary
A structure includes a main substrate including a first surface and a second surface opposite to the first surface, a power supply module on the main substrate, a socket in the main substrate, and one or more power supply wirings and one or more signal wirings extending in a thickness direction of the main substrate and penetrating the socket. Each of the one or more power supply wirings includes a first end on the first surface side and a second end on a side opposite to the first end. Each of the one or more signal wirings includes a third end to be electrically connected to an electronic component and a fourth end on a side opposite to the third end. The fourth end is electrically connected to a conductor pattern on the first surface.