Carrier Plate Assembly for Compact Vertical Power Modules

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Solution Overview

Problem

Existing power supply modules face challenges in improving efficiency, reducing size, and enhancing integration and application reliability when supplying power out-of-plane to ASICs, particularly in high-current applications.

Innovation Solution

A manufacturing method involving a carrier plate with depth-controlled grooves and a power supply module assembly process that reduces reflow soldering times and assembly errors, utilizing a special-shaped carrier plate with controlled depth grooves and a magnetic assembly structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional coplanar power supply solution is used, then the power supply module can supply power to ASIC, but the integration level and space utilization are limited

Engineering Contradiction:

Improveintegration levelVSAvoidpower supply module size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a coplanar power supply architecture to a vertical out-of-plane architecture. The power supply module is positioned above the ASIC chip and connects through vertical vias and interconnect structures, utilizing the third dimension (Z-axis) to improve integration density and reduce lateral footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If out-of-plane vertical power supply solution is adopted, then space utilization improves, but assembly precision and reliability become more challenging

Engineering Contradiction:

Improvepower supply module sizeVSAvoidassembly precision

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent employs preliminary alignment features such as alignment marks, precision-machined mounting surfaces, and pre-positioned interconnect structures. The carrier plate includes precision holes and grooves that guide the placement of magnetic components and ensure accurate alignment during assembly, reducing the complexity of high-precision vertical alignment.

Inventive Principle:

Principle #10Preliminary action

3Ease of operation

If multiple reflow soldering processes are used, then component assembly is achieved, but assembly errors increase and reliability decreases

Engineering Contradiction:

Improveassembly easeVSAvoidapplication reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent divides the power supply module into distinct functional assemblies (e.g., magnetic component assembly, capacitor assembly, PCB assembly) that can be pre-assembled and tested separately. This modular approach allows each subsystem to be optimized and validated independently, reducing the need for multiple reflow cycles on the entire module and minimizing cumulative assembly errors.

Inventive Principle:

Principle #1Segmentation

4Ease of manufacture

If conventional manufacturing process is used, then production is simplified, but manufacturing precision and bonding strength are insufficient

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidbonding strength

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent specifies controlled parameters for the depth-controlled grooves and precision holes, including tight tolerances on depth, diameter, and positioning. These parameter controls ensure consistent bonding strength for adhesives and soldering quality for interconnects, while the standardized process steps maintain manufacturing feasibility.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances the integration level, reduces the power supply module size, and improves reliability by minimizing assembly errors and reflow soldering frequency, while maximizing space utilization and bonding strength.

Implementation Method 1

the double-sided copper-clad plate, the PP layer and the thick copper are cured at high temperature to form a substrate

Methodology Applied

Scientific EffectHigh temperature curing: Heat Treatment

Implementation Method 2

after the inner wall of the hole is electroplated

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS20250266364A1Method for manufacturing carrier plate, power supply module, assembly method therefor and magnetic assembly

Publication Date: 2025.08.21 SHANGHAI METAPWR ELECTRONICS CO LTD

AI summary

The application provides a manufacturing method of a carrier plate, a power supply module and an assembling method of the power supply module. The manufacturing method of the carrier plate includes the following steps: step 1, forming a substrate; step 2, vertically drilling a hole, and forming a connector; step 3, performing mechanical drilling to form a hole; and step 4, performing depth-controlled milling groove, wherein the power supply module includes a carrier plate, a magnetic core, a first assembly and a third assembly; the magnetic core includes a magnetic column, a first magnetic cover plate and a second magnetic cover plate, the magnetic column penetrates through the hole, and the first magnetic cover plate and the second magnetic cover plate are respectively accommodated in the first depth-controlled groove and the second depth-controlled groove and are buckled with the magnetic column to form a second assembly.