Built-In Wiring Board Resin Structure for Flush Component Mounting

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Solution Overview

Problem

Existing component built-in wiring boards require a large amount of resin to fill the spaces between electronic components with different heights, leading to inefficiencies and potential connection failures.

Innovation Solution

A method involving a core substrate with an opening, where electronic components with different heights are connected by a second resin part to ensure flush terminal surfaces, reducing the need for a first resin to fill the space and improving interlayer insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components with different heights are positioned in the opening portion, then the wiring board can accommodate components of varying sizes, but a large amount of resin is required to fill the spaces between components, increasing material usage and potential connection failures

Engineering Contradiction:
Improveaccommodation of electronic components with different heightsVSAvoidamount of resin required to fill spaces
Core Design Contradiction:
Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

A resin part is introduced as an intermediary element between electronic components of different heights. This resin part includes a first resin part filling the space between the core substrate and the second resin part, and a second resin part connecting the electronic components. The resin part acts as a mediator that bridges the height difference without requiring excessive filling resin, thereby reducing material usage while maintaining component adaptability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The resin part is segmented into two distinct parts: a first resin part and a second resin part. The first resin part fills the space between the core substrate and the second resin part, while the second resin part connects the electronic components. This segmentation allows the resin to be distributed more efficiently, reducing the total amount of resin needed compared to filling all spaces uniformly.

Inventive Principle:
Principle #1Segmentation

2Stability of the object's composition

If a large amount of resin is used to fill the opening portion, then all spaces are filled, but connection reliability decreases and manufacturing efficiency is reduced

Engineering Contradiction:
Improvefilling of spaces in opening portionVSAvoidconnection reliability of electronic components
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The resin part serves as a structured intermediary that provides reliable connection between electronic components. By dividing the resin into functional parts (first resin part for filling and second resin part for connection), the structure ensures proper positioning and electrical connection without the reliability issues associated with excessive resin filling.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If electronic components with different heights are connected without a structured resin part, then assembly is simpler, but terminal surfaces cannot be made flush, affecting subsequent lamination processes

Engineering Contradiction:
Improveassembly of electronic componentsVSAvoidflushness of terminal surfaces
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The resin part acts as a precision intermediary that enables flush terminal surfaces. The first resin part fills the space between the core substrate and the second resin part, while the second resin part connects the electronic components at appropriate heights. This structured approach maintains manufacturing simplicity while achieving the precision required for flush terminal surfaces, enabling successful lamination of the build-up part.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250239535A1Component built-in wiring board and method for manufacturing component built-in wiring board
Publication Date: 2025.07.24 IBIDEN CO LTD
  • US20250239535A1 patent drawing
  • US20250239535A1 patent drawing
  • US20250239535A1 patent drawing

AI summary

A component built-in wiring board includes a core substrate having an opening, electronic components positioned in the opening of the substrate such that the electronic components are spaced apart with respect to each other, a build-up part formed on the substrate such that the build-up part is covering the electronic components in the opening of the substrate, and a resin part formed in the opening of the substrate and including a first resin part and a second resin part such that the second resin part is connecting the electronic components in the opening of the substrate and the first resin part is filling a space formed between the core substrate and the second resin part in the opening of the 10 substrate. The second resin part of the resin part is connecting the electronic components having different heights such that terminal surfaces of the electronic components are flush with each other.