Dielectric-Immersed PCB Chip Layout for Higher Packing Density

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Solution Overview

Problem

Existing circuit board assemblies for large-scale computing face challenges in increasing chip density due to the use of metallic spacers for heat dissipation and voltage drop, which occupy valuable space and reduce the number of chips that can be packed on a PCB, leading to decreased computing performance and energy efficiency.

Innovation Solution

The assembly eliminates or reduces the use of metallic spacers between adjacent chips, allowing for closer chip placement and immersion in dielectric liquid for cooling, thereby increasing chip density and reducing voltage drop.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metallic spacers are used between adjacent chips for heat dissipation and voltage drop management, then heat dissipation and voltage stability are improved, but chip density decreases due to occupied space

Engineering Contradiction:

Improvevoltage stabilityVSAvoidchip density

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The patent removes metallic spacers from between adjacent chips, extracting the heat dissipation and voltage management function to an alternative solution (dielectric liquid immersion). This eliminates the space occupation by spacers, allowing chips to be placed closer together and increasing chip density on the circuit board.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces dielectric liquid immersion as the cooling and electrical isolation medium, replacing solid metallic spacers. The liquid fills the gaps between chips, providing both thermal management through convection and electrical isolation through its dielectric properties, enabling closer chip placement without compromising voltage stability.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Temperature

If metallic spacers are used between adjacent chips, then heat dissipation is improved, but chip density decreases due to occupied space

Engineering Contradiction:

Improveheat dissipationVSAvoidchip density

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

The patent removes metallic spacers from between adjacent chips, extracting the heat dissipation function to an alternative solution (dielectric liquid immersion). This eliminates the space occupation by spacers, allowing chips to be placed closer together and increasing chip density on the circuit board.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces dielectric liquid immersion as the cooling medium, replacing solid metallic spacers. The liquid fills the gaps between chips, providing thermal management through convection and conduction, enabling closer chip placement while maintaining effective heat dissipation.

Inventive Principle:

Principle #29Pneumatics and hydraulics

3Productivity

If chip spacing is reduced to increase chip density, then computing performance increases, but voltage drop between chips increases

Engineering Contradiction:

Improvecomputing performanceVSAvoidvoltage drop

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The patent introduces dielectric liquid as an intermediary medium between closely spaced chips. This liquid provides electrical isolation and maintains stable voltage levels between adjacent chips, allowing them to be placed closer together for increased computing performance without suffering from excessive voltage drop.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Productivity

If more chips are packed on a PCB, then computing performance increases, but heat generation increases

Engineering Contradiction:

Improvecomputing performanceVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent uses dielectric liquid immersion to provide efficient thermal management for high-density chip arrangements. The liquid circulates around the chips, absorbing and removing heat through convection, enabling higher chip density and computing performance without excessive heat accumulation.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables more chips to be packed on a PCB, enhancing computing performance and energy efficiency by increasing the hash rate and reducing power consumption.

Implementation Method 1

the dielectric liquid is thermo-conductive

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a boilerplate that is coupled to the plurality of chips. The boilerplate is configured to dissipate heat generated by the plurality of chips

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

a dielectric liquid in which the circuit board is immersed

Methodology Applied

Scientific EffectDielectric insulation: Dielectric

Data Source

PatentUS12400946B2Circuit board assembly having circuit board with adjacent chips immersed in dielectric liquid and method of making the same

Publication Date: 2025.08.26 AURADINE INC

AI summary

A circuit board assembly is provided. The circuit board assembly includes a circuit board and a plurality of chips assembled on a surface of the circuit board. The plurality of chips include integrated circuit (IC) chips. At least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips. A circuit board and a method for circuit board assembly are also provided.