Integrated Ground Plane Connector for Fine-Pitch Signal Shielding
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Solution Overview
Problem
Conventional electrical connectors face challenges in making reliable separable connections to semiconductor devices with decreasing pitch, particularly below 50 microns, due to mechanical and assembly difficulties, and require simultaneous connection to multiple contact pads, which is expensive and difficult to achieve.
Innovation Solution
A connector design incorporating an integrated ground plane with compliant spring elements, where a subset of contact elements are trapped or compressed under the ground plane, providing ground shielding without external connections, reducing the number of protruding elements and compression force required, and allowing for compact size and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical connectors are used to make separable connections to semiconductor devices with pitch below 50 microns, then connection reliability is required, but manufacturing complexity and assembly difficulty increase dramatically
Solution Approach 1:
The patent combines multiple contact elements into a single integrated contact array structure that simultaneously engages with multiple contact pads. The contact array is formed as one piece with continuous conductive material, eliminating the need to individually assemble multiple separate contacts, thereby reducing assembly complexity while maintaining reliable electrical connection to all pads simultaneously
Solution Approach 2:
The contact array serves multiple functions: it provides electrical connection to multiple contact pads simultaneously, acts as a self-aligning mechanism during assembly, and provides mechanical retention force. This multi-functionality reduces the number of separate components needed and simplifies the overall assembly process while ensuring reliable connections
2Reliability
If conventional electrical connectors are used to make separable connections to semiconductor devices with decreasing pitch, then connection reliability is required, but cost increases
Solution Approach 1:
The patent combines multiple contact elements into a single integrated contact array formed from continuous conductive material. This reduces manufacturing steps compared to individually forming, plating, and assembling multiple separate contacts, thereby lowering production costs while maintaining reliable electrical connection to all contact pads simultaneously
3Reliability
If multiple contact elements are made to protrude from the connector surface, then electrical connection is achieved, but compression force and device size increase
Solution Approach 1:
The patent transitions from a planar arrangement where multiple contact elements protrude outward to a three-dimensional configuration where contact elements are distributed across the surface of a spherical contact body. This spatial distribution allows electrical connection to multiple pads with reduced individual compression forces while maintaining compact overall dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances electrical connectivity by reducing compression force, minimizing interference, and enabling compact design while providing effective ground shielding and thermal management for high-speed signal pins.
Implementation Method 1
each contact element including a compliant spring element
Data Source
AI summary
An electrical connector includes a contact array of signal pins and an integrated ground plane. In one embodiment, the electrical connector includes an array of contact elements and the integrated ground plane includes openings for contact elements forming signal pins and includes closed portions positioned over contact elements to be connected to the ground potential. The array of contact elements is formed with a subset of the contact elements being trapped or compressed under the integrated ground plane. The trapped contact elements are electrically connected to the ground potential without each being connected to a ground connection external to the connector. The integrated ground plane can be provided integrally within the electrical connector or as a separate element attached to the connector. In another embodiment, an electrical connector includes an array of contact elements formed in a contact element layer incorporating an integrated ground plane.