Embedded PCB Component Lamination Without Added Cover Layers
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Solution Overview
Problem
Conventional methods for embedding electronic components in printed circuit boards result in inhomogeneities due to differing thermal expansion coefficients of materials, leading to cracks and reduced durability, and the resulting boards are thicker than desired for miniaturization.
Innovation Solution
A method involving a combination of layers with curable prepreg material, temporary carrier layers, and controlled compression to embed components without additional covering layers, allowing the resin to flow around the components and form a continuous phase, reducing stress and enabling thin boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to fix components in the printed circuit board, then components can be securely fixed, but inhomogeneities are created due to differing thermal expansion coefficients, leading to cracks and reduced durability
Solution Approach 1:
The patent applies the homogeneity principle by using the same prepreg resin material for both the insulating layers and the component fixation. This eliminates the material interface between different materials (adhesive vs. insulating layer), creating a homogeneous structure with uniform thermal expansion properties throughout, thereby preventing crack formation at material boundaries while maintaining secure component fixation.
2Reliability
If additional prepreg layers are used to cover components, then components are properly embedded and fixed, but the printed circuit board becomes thicker, contradicting miniaturization requirements
Solution Approach 1:
The patent merges the function of component fixation with the existing insulating layers by creating clearances within the prepreg material itself before curing. The prepreg resin flows into and around the components during lamination, eliminating the need for separate covering layers. This combines the structural and fixation functions into a single integrated layer, achieving reliable embedding without increasing board thickness.
3Ease of manufacture
If clearances are created for component insertion, then components can be embedded, but the board thickness increases due to required covering layers
Solution Approach 1:
The patent applies preliminary action by creating clearances in the prepreg material before the components are inserted and before the resin is cured. The clearances are formed in the B-stage (partially cured) prepreg, allowing easy insertion of components. Subsequently, the resin is fully cured in place, locking the components securely without requiring additional covering layers, thus maintaining thin board profile while enabling easy manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces thin, homogeneous printed circuit boards with minimal thermal stress and improved durability by eliminating the need for additional prepreg layers, aligning with miniaturization requirements.
Implementation Method 1
the resin of the prepreg material, characterized in that a sequence of the following steps is carried out: a) providing a combination of the layers of the printed circuit board or of the printed circuit board intermediate product wherein this the combination includes at least one curable prepreg material; b) creating a clearance in the combination for accommodating the component to be embedded; c) covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; d) positioning the component to be embedded in the clearance by way of the first temporary carrier layer; e) covering at least the region of the clearance on a second side of the combination with a second temporary carrier layer; f) compressing the combination with the component, curing the curable prepreg material
Implementation Method 2
f) compressing the combination with the component, curing the curable prepreg material
Implementation Method 3
In the production of printed circuit boards, the insulating layers, which are made of a prepreg material, are joined to the conducting layers by lamination and compression at elevated temperatures
Data Source
AI summary
A printed circuit board or a printed circuit board intermediate product, comprises a first main surface and a second main surface; a combination of layers including a plurality of insulating layers and at least one first metal layer, wherein the at least one first metal layer extends along a first horizontal plane in parallel to at least one of the first and second main surfaces; at least one cavity in the printed circuit board or the printed circuit board intermediate product, said cavity extending through at least one of the plurality of insulating layers; and a component inserted in the at least one cavity, said component being embedded in said at least one cavity by a material from the at least one insulating layer through which the cavity extends.