Molded Circuit Board Structure for Flat, Heat-Dissipating Camera Modules

The patent changes the material parameter of the protective layer from traditional ink-based materials to molding compound materials. This parameter change maintains the electrical insulation function while significantly improving heat dissipation performance, as molding compounds have better thermal conductivity properties compared to conventional ink layers.

The patent uses composite material structure where the molding compound integrates multiple functions: structural support, electrical insulation, and heat dissipation. The molding compound forms a composite protective layer that combines the benefits of mechanical strength with improved thermal management capabilities.

The patent changes the physical state and surface properties of the protective layer by using molding compound that cures to form a flat surface. The molding process ensures uniform thickness and surface flatness, eliminating the surface irregularities inherent in printed or sprayed ink layers.

The patent replaces the chemical/drying-based ink application process with a mechanical molding process. The molding die physically forms the protective layer with precise dimensional control, ensuring surface flatness required for accurate chip mounting while maintaining circuit protection functions.

The patent merges multiple functions into a single integrated molding process. The molding compound application and curing step simultaneously provides structural support, electrical insulation, heat dissipation pathways, and surface flatness - combining what would otherwise require multiple separate manufacturing steps into one unified process.

The molding compound serves multiple universal functions: it provides mechanical structural support, electrical insulation, thermal management through heat dissipation, and creates a flat mounting surface. This multi-functionality reduces the need for additional separate components or processing steps.