BGA Power-Ground Ball Layout for Low-Impedance IC Packaging
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Solution Overview
Problem
Conventional ball grid array (BGA) packaged IC components face challenges in reducing size while maintaining low impedance and avoiding increased fabrication costs due to the need for denser vias and smaller pitches, which complicates the fabrication process and can lead to higher impedance when reducing via quantities.
Innovation Solution
The control device and electronic apparatus employ a ball grid array with alternating arrangements of ground and power balls, where the pitch between ground balls is greater than that between adjacent ground and power balls, allowing for reduced size without compromising via space, and an alternating arrangement of ground and power vias to minimize parasitic inductance and impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pitch between solder balls is shortened to reduce the size of the packaged IC component, then the size is reduced, but the space for arranging ground vias and power vias is further reduced
Solution Approach 1:
The patent merges ground balls and power balls into a unified ball grid array region, allowing them to be interleaved in an alternating pattern. This integration enables more efficient use of the limited space created by reduced pitch, as both ground and power connections share the same spatial domain rather than occupying separate regions.
Solution Approach 2:
The patent transitions from separate regional arrangements of ground and power balls to a two-dimensional interleaved grid pattern. By organizing balls in alternating columns and rows across the entire array, the design充分利用 the available space in both horizontal and vertical dimensions, maximizing via placement options within the reduced pitch constraints.
2Loss of energy
If the numbers of ground balls and power balls are increased to reduce voltage drop, then the current paths are increased, but the numbers of ground vias and power vias are increased making the arrangements denser
Solution Approach 1:
The patent segments the ball grid array into alternating columns of ground balls and power balls. This segmentation creates a regular, repeating pattern that simplifies the overall design while providing numerous distributed connection points. The segmented structure naturally increases the number of available vias for power and ground connections without requiring complex irregular arrangements.
Solution Approach 2:
The patent changes the arrangement parameter from separate regional groupings to an alternating interleaved pattern. This parameter change increases the density of both ground and power balls in a systematic way that provides more current paths while maintaining a regular, manageable via arrangement pattern that is easier to fabricate than irregular dense arrangements.
3Volume of moving object
If the respective quantities of solder balls, ground vias, and power vias are decreased to minimize the size, then the size is reduced, but the impedance increases
Solution Approach 1:
The patent applies local quality by creating alternating regions of ground balls and power balls throughout the array. This local differentiation ensures that both ground and power connections are distributed uniformly across the entire device, providing adequate connection density in every local region. The alternating pattern guarantees that no area is deprived of sufficient vias, maintaining low impedance while minimizing overall size.
Solution Approach 2:
The patent creates a dynamic balance between size reduction and impedance control through the alternating ball pattern. The interleaved arrangement allows the design to adapt to space constraints by efficiently packing both ground and power connections into the minimal required area, while the regular pattern ensures sufficient via density is maintained throughout to control impedance.
Data Source
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AI summary
A control device (1) and a circuit board (2) are provided. The control device (1) can cooperate with the circuit board (2), and includes a ball grid array (10). The ball grid array (10) includes a plurality of power balls (PI) and a plurality of ground balls (G1), which are jointly arranged in a ball region (10R). The power balls (P1) and the ground balls (G1) are respectively divided into a plurality of power ball groups (101, 101') and a plurality of ground ball groups (100). One of the ground ball groups (100) includes two ground balls (G1) and is adjacent to a power ball group. A ball pitch (d1) between the two ground balls (G1) is greater than that between one of the power balls (P1) and one of the ground balls (G1) adjacent to each other. The circuit board (2) includes a contact pad array (200) corresponding to the ball grid array (10) of the control device (1) so that the control device (1) can be disposed on the circuit board (2).