Conductive Particle Coating Gradient for PCB-Display Connections
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Solution Overview
Problem
Existing display device manufacturing methods face challenges in efficiently connecting display panels with printed circuit boards without causing short circuits, particularly due to the placement and spacing of conductive particles.
Innovation Solution
A display device design that includes a display panel with pad electrodes, a printed circuit board with lead electrodes, conductive particles spaced at predetermined intervals, and a coating layer with varying thickness, which is applied using a jetting method and thermally pressed to ensure proper alignment and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive particles are placed to ensure electrical connection, then electrical connectivity is improved, but risk of short circuits increases
Solution Approach 1:
The coating layer is applied with varying thickness in the first direction from the lead electrodes toward the pad electrodes, creating local variations in insulation quality. This allows the coating to provide sufficient insulation where needed while maintaining electrical connection where required, thus resolving the contradiction between electrical connectivity and short circuit prevention.
Solution Approach 2:
The coating layer is applied to the conductive particles before final assembly, pre-establishing the insulation barrier. This preliminary action ensures that the insulation protection is in place before the conductive particles are positioned, preventing short circuits while maintaining electrical connection capabilities.
2Object-affected harmful factors
If conductive particles are spaced at predetermined intervals, then short circuit prevention is improved, but manufacturing precision requirements increase
Solution Approach 1:
The thickness of the coating layer is varied as a parameter in the first direction from the lead electrodes toward the pad electrodes. This parameter change provides a gradient insulation effect that compensates for variations in particle placement, allowing predetermined spacing to effectively prevent short circuits while reducing the stringency of manufacturing precision requirements.
3Reliability
If coating layer thickness varies, then electrical connection control is improved, but manufacturing complexity increases
Solution Approach 1:
The coating layer exhibits local quality variations in thickness in the first direction, with different thicknesses at different locations. This local quality approach allows precise control of electrical connection characteristics without requiring complex multi-step coating processes, as the variation can be achieved through controlled application methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents short circuits by ensuring precise placement and spacing of conductive particles, while also enhancing the electrical connection between the display panel and the printed circuit board, thereby improving the reliability and performance of the display device.
Implementation Method 1
jetting a plurality of conductive particles and a coating layer on a plurality of pad electrodes
Implementation Method 2
thermally pressing a printed circuit board to the first substrate
Data Source
AI summary
A display device includes: a display panel including a plurality of pad electrodes arranged in a first direction; a printed circuit board including a plurality of lead electrodes facing the plurality of pad electrodes, respectively; a plurality of conductive particles disposed between the display panel and the printed circuit board at predetermined intervals; and a coating layer disposed on the plurality of conductive particles and having a thickness varying in the first direction from each of the plurality of lead electrodes toward each of the plurality of pad electrodes.