Angled PCB Detector Module for CT Signal Processing

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Solution Overview

Problem

Conventional X-ray detectors with a two-dimensional arrangement of modules lack sufficient space for signal-processing electronics, which are essential for effective measurement and heat dissipation, as they require a larger area than the detector modules and generate significant heat during operation.

Innovation Solution

A detector module design featuring a printed circuit board with a second region angled off from the first, allowing signal-processing electronics to be vertically arranged below the detector elements, with a carrier for heat dissipation and electromagnetic interference protection, and using a U-shaped or L-shaped printed circuit board to route signals and prevent protrusion, enabling efficient signal processing and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If detector modules are arranged in a two-dimensional array to form a large detection area, then the detection area is maximized, but there is insufficient space for signal-processing electronics close to the detector elements

Engineering Contradiction:
Improvedetection areaVSAvoidspace for signal-processing electronics
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent transitions from a planar arrangement to a vertical three-dimensional structure. The printed circuit board is angled at approximately 45 degrees relative to the detector element array, allowing signal-processing electronics to be positioned below the detector elements in the vertical dimension rather than requiring additional horizontal space. This enables close proximity of electronics to detection area while maintaining large detection area capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If signal-processing electronics are positioned close to detector elements for effective measurement, then measurement precision is improved, but heat dissipation becomes problematic due to limited space

Engineering Contradiction:
Improvesignal processing accuracyVSAvoidheat generation in electronics
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The vertical arrangement of the printed circuit board at an angle creates three-dimensional space for heat dissipation pathways. This spatial configuration allows heat to be conducted away from the electronics through the board structure and into the surrounding environment, effectively managing thermal load while maintaining close electrical coupling between detector elements and signal-processing circuits.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If a conventional flat printed circuit board is used, then manufacturing is simple, but the electronics protrude from the sides preventing compact two-dimensional arrangement of detector modules

Engineering Contradiction:
Improveprinted circuit board fabricationVSAvoiddetector module profile
Core Design Contradiction:
Ease of manufactureVSShape

Solution Approach 1:

The printed circuit board is configured at an approximate 45-degree angle relative to the detector element array plane, transforming it from a flat two-dimensional component to a three-dimensional angled structure. This angular configuration allows the electronics to be positioned below the detector elements without protruding from the lateral boundaries, enabling compact stacking of multiple detector modules in two dimensions while maintaining manufacturing feasibility through standard PCB fabrication processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for a compact, efficient arrangement of detector modules in two dimensions, ensuring close proximity of signal-processing electronics to the detection area, effective heat dissipation, and preventing overheating, thus enabling stable operation and high-quality imaging in computer tomographs.

Implementation Method 1

The elements of the scintillator array convert X-ray radiation hitting them into visible light

Methodology Applied
Scientific EffectScintillation: Scintillation

Implementation Method 2

which is converted into electrical signals by the downstream photodiodes of the photodiode array

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 3

a carrier for heat dissipation and electromagnetic interference protection

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7358501B2Detector module, detector and computer tomograph
Publication Date: 2008.04.15 SIEMENS HEALTHINEERS AG
  • US7358501B2 patent drawing
  • US7358501B2 patent drawing
  • US7358501B2 patent drawing

AI summary

A detector module is disclosed, having an array of detector elements and a printed circuit board. The printed circuit board includes a first region for holding the array of detector elements and includes at least one second region, angled off relative to the first region. On this at least one second region, signal-processing electronics may be arranged. The vertical design of the detector module allows the design of an area detector to be produced on the basis of a multiplicity of detector modules arranged next to one another. The area detector may be provided for a computer tomograph.