Angled PCB Lead Frame for LED Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing printed circuit boards face challenges in mounting components at specific angles and ensuring reliable heat dissipation, particularly for directional components like light-emitting diodes, which require large installation spaces and limited heat dissipation via vias.
Innovation Solution
A three-dimensional stamped grid with angled legs that make electrical contact and provide heat dissipation, allowing components to be mounted at defined angles without additional thermal measures, and enabling space-saving installations by serving as both current and heat conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vias are used for heat dissipation in SMD LED mounting, then electrical connection is achieved, but heat dissipation capability is limited
Solution Approach 1:
The patent combines the electrical connection function and heat dissipation function into a single integrated structure. The stamped grid serves dual purposes: providing electrical pathways for current flow and acting as a thermal management system through its extended legs that contact the LED component and dissipate heat, eliminating the need for separate via structures.
Solution Approach 2:
The stamped grid extends in the vertical dimension with legs that protrude from the circuit board surface. These legs provide additional surface area for heat dissipation and create multiple contact points with the LED component, moving the heat dissipation function from a two-dimensional via plane to a three-dimensional structure.
2Ease of operation
If directional components are mounted on printed circuit boards, then specific orientation is achieved, but installation space increases
Solution Approach 1:
The stamped grid structure utilizes the vertical dimension by extending legs upward from the circuit board surface. This allows the LED component to be mounted in a defined orientation above the board plane, achieving directional requirements without increasing the horizontal footprint of the installation.
Solution Approach 2:
The stamped grid serves multiple functions simultaneously: it provides mechanical support for the component, establishes electrical connections through its conductive pathways, enables thermal management through heat-conducting legs, and defines component orientation. This multi-functionality eliminates the need for separate mounting structures that would increase installation space.
3Strength
If conventional mounting methods are used, then component attachment is achieved, but heat dissipation requires additional thermal measures
Solution Approach 1:
The patent merges the mechanical attachment function and thermal management function into the same stamped grid structure. The legs of the grid both secure the LED component mechanically and conduct heat away from the component, eliminating the need for separate thermal measures such as heat sinks or thermal paste applications.
Solution Approach 2:
The stamped grid structure is self-sufficient, providing both mechanical support and thermal management capabilities inherently through its design. The metal legs naturally conduct heat from the LED component to the circuit board without requiring additional thermal interface materials or active cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable heat dissipation and secure component positioning, allowing for compact and efficient integration of components like light-emitting diodes in small housings, such as those used in motor vehicle interiors, with effective light beam bundling and reduced installation space requirements.
Implementation Method 1
the legs made of metal serve both as current conductors and for heat conduction or transmission. The relatively large leg of the stamped grid results in relatively fast heat transport.
Implementation Method 2
a light-emitting diode, the connection contacts of which are soldered on the upper side of the component
Implementation Method 3
In order to bundle emitted light beams, a reflector arranged on the stamped grid is preferably assigned to the illuminant designed as a light-emitting diode.
Data Source
Figure 1~3
AI summary
The board (1) has a three-dimensionally shaped punched grid (6) comprising multiple current paths (5) partially encapsulated by plastic and an electric or electronic component. The punched grid is of angular construction, where free end faces of the current paths of the punched grid extending over grid legs to contact the printed circuit board and the component is arranged between the current paths in a defined orientation.