Printed Circuit Assembling TRIZ Cases

Orthogonal electronic module mounting reduces mold compound volume and substrate dimensions, resolving integration density limits in high density packages.

Multi-layer PCB integrates conductive plate with protruding heat poles to absorb and dissipate thermal energy from power semiconductor modules.

A composite Cu-rich core and Sn-rich outer layer form an hourglass solder bump that prevents bridge defects while maintaining thermal reliability.

Integrated adhesive with reflective particles eliminates costly vapor deposition layers while maintaining die shear strength.

Pilot pins protruding through the circuit board engage centering holes in the housing, resolving play-induced damage during press-contact assembly.

Cylindrical contact pads prevent short-circuiting adjacent wires while maintaining sufficient area and structural strength for reliable probe needle contact.

Non-conductive paste within solder resist isolates de-featured interconnects from upper metallization, reclaiming substrate space.

An integrated insulating body secures contact elements in plated-through holes using asymmetric clamping forces to prevent misalignment during board detachment.

Palladium diffusion forms intermetallic compounds in lead-free solder, reducing crack lengths from 80 μm to under 20 μm during thermal cycling.

Insulator islands sandwiched between ITO films prevent water ingress and corrosion at the LCD external terminal interface.

Ternary transient liquid phase bonding forms void-free, creep-resistant interconnects that maintain low thermal resistance under high temperature cycling.

Three-dimensional stamped grid with angled legs conducts current and dissipates heat from light-emitting diodes, solving space constraints.

A component-mounted structure uses a core of metal and resin particles within an intermetallic compound layer to raise the joint re-melting temperature.

T-shaped solder pads with extended edges increase alignment contact points for solid state lighting components.

Folding a flexible printed circuit board creates a three-dimensional matrix that increases power capacity while reducing weight and size.

An optical alignment system directs radiation from substrate marks to a detector for precise positioning.

A heat dissipation material using metallic glass and organic vehicle improves thermal conductivity at the junction.

A display module uses a fixing layer with protrusions engaging via holes in the back plate to secure the bending region.

A printed circuit board uses a solder aggregation member to reinforce junctions without increasing package size.

Vertical pillar connections eliminate outer leads in stacked structures, reducing surface area and impedance without requiring additional substrate space.

A printed circuit board assembly edge-couples to an integrated circuit using coaxial connectors.

Antenna integrated printed wiring board with laser-drilled microvias and offset plated through vias for direct die connection.

Cuttable attachment members conform to component position deviations, correcting housing alignment errors without software intervention.

Laser processing creates non-overlapping tracks on substrates to guide etching for precise hole formation.

Multi-layer metallization suppresses intermetallic compound growth to maintain low contact resistance without expensive noble metal plating.

A supporting member with multiple installation surfaces connects circuit boards in an electronic device.