Electronic Device Supporting Member for Compact Heat Dissipation

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Solution Overview

Problem

Existing electronic devices face challenges in integrating multiple communication modules efficiently while maintaining a compact form factor and effective heat dissipation.

Innovation Solution

The electronic device incorporates an upper and lower housing with a supporting member connecting first and second circuit boards, featuring a first installation surface, a second installation surface, and a bending portion, along with a connecting part for secure fixation, allowing for compact integration and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple communication modules are integrated into a compact electronic device, then the functionality and versatility are improved, but the heat dissipation becomes more difficult and the device complexity increases

Engineering Contradiction:
Improvecommunication functionalityVSAvoidheat dissipation
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The supporting member is divided into multiple functional surfaces (first installation surface for RF circuit board, second installation surface for display module, third installation surface for battery) and a bending portion, allowing each component to be independently installed and heat to be dissipated across different areas rather than concentrated in one location

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The supporting member extends in multiple spatial dimensions with surfaces arranged at different levels and orientations, creating a three-dimensional layout that separates heat-generating components from heat-sensitive components while maintaining compact integration

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple communication modules are integrated into a compact electronic device, then the functionality is improved, but the device complexity increases

Engineering Contradiction:
Improvecommunication functionalityVSAvoidstructural complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The supporting member serves multiple functions simultaneously: it provides mechanical support for the RF circuit board, displays, and battery; acts as a heat dissipation structure; and serves as a structural connector between different device components, thereby reducing the need for separate dedicated parts

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The supporting member combines the functions of multiple separate components (support structure, heat sink, mounting bracket) into a single integrated part, reducing assembly steps and overall device complexity while maintaining the ability to support multiple communication modules

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP4470344B1Electronic device
Publication Date: 2026.04.15 SAMSUNG ELECTRONICS CO LTD
  • EP4470344B1 patent drawingFigure 1~2
  • EP4470344B1 patent drawingFigure 3~5
  • EP4470344B1 patent drawingFigure 6

AI summary

Disclosed is an electronic device including an upper housing and a lower housing, a first circuit board, a second circuit board, and a supporting member connected between the first circuit board and the second circuit board being provided between the upper housing and the lower housing. The supporting member has a first installation surface, a second installation surface, and a bending portion connected between the first installation surface and the second installation surface. The first installation surface is located below the second installation surface and the first circuit board is provided on the first installation surface. A connecting part is provided on the first circuit board, the first circuit board is fixed to the first installation surface by the connecting part, the second circuit board is fixed to the second installation surface, the lower housing is connected with the connecting part.