Stacked Electronic Structure Reducing Surface Area and Impedance
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Solution Overview
Problem
Conventional stacked electronic structures require more surface area and increase impedance due to the use of outer conductive leads for connecting electronic devices to substrates, which limits their compactness and efficiency.
Innovation Solution
A stacked electronic structure design where magnetic devices are supported by bridge structures and electronic devices are connected directly to the magnetic device and substrate without using the substrate for electrical connections, reducing the need for outer leads and minimizing conductive path length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If outer conductive leads are used to connect electronic devices to substrate, then electrical connections are established, but surface area is increased and impedance is increased
Solution Approach 1:
The patent extracts and eliminates the outer conductive leads from the conventional stacked electronic structure. Instead of using traditional leads that extend outward from the substrate, the invention directly connects electronic devices to the substrate through vertical stacking, removing the unnecessary lateral connection paths and reducing the surface area occupied by leads.
Solution Approach 2:
The invention transitions from a two-dimensional lateral connection approach to a three-dimensional vertical connection approach. Electronic devices are stacked vertically over the substrate, with electrical connections established through the vertical dimension rather than through lateral lead extensions, thereby reducing the surface footprint.
2Reliability
If outer conductive leads are used to connect electronic devices to substrate, then electrical connections are established, but overall impedance is increased
Solution Approach 1:
The patent removes the outer conductive leads that contribute to increased impedance. By eliminating these lateral connection paths and replacing them with direct vertical connections between stacked devices and the substrate, the overall impedance of the electrical connections is reduced.
Solution Approach 2:
The invention changes the connection dimension from lateral to vertical, creating shorter and more direct electrical pathways. This dimensional shift reduces the length and complexity of current paths, thereby minimizing impedance effects.
3Reliability
If conventional stacked structure is used, then electronic devices are connected, but design flexibility is limited
Solution Approach 1:
The patent segments the electrical connection function into multiple independent vertical pathways, allowing different electronic devices to be connected to different regions of the substrate independently. This segmentation enables greater design flexibility in arranging devices and routing connections without the constraints of fixed lead patterns.
Data Source
AI summary
A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.