Universal Solder Pad Design for LED Alignment
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Solution Overview
Problem
Conventional solder pads require customization to accommodate various sizes, shapes, and designs of solid state lighting apparatuses, leading to time and cost inefficiencies and alignment issues during the soldering process, which can result in defects such as shorted apparatuses and dark spots in the light beam.
Innovation Solution
The introduction of solder pads with a first and second pad separated by a gap, featuring shapes like slots to increase alignment edges, allowing for universal compatibility with different sized and shaped solid state lighting apparatuses, thereby improving alignment and reducing misalignment during the soldering process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional solder pads are customized to accommodate various sizes and shapes of solid state lighting apparatuses, then compatibility with different apparatuses is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent implements a universal solder pad design with standardized dimensions and a T-shaped configuration that can accommodate multiple types of solid state lighting apparatuses including LEDs, laser diodes, and phosphor-converted LEDs. The standardized pad size of 0.060 inches by 0.060 inches serves as a universal interface for different apparatus sizes and shapes, eliminating the need for custom pad designs for each apparatus type.
2Productivity
If conventional solder pads are used during the soldering process, then the soldering process can be completed, but misalignment and rotation of apparatuses occur due to solder flow
Solution Approach 1:
The patent applies preliminary anti-action by designing the T-shaped solder pad with extended edges that create mechanical constraints before soldering occurs. The extended edge of the T-shape prevents rotation and sliding of the apparatus during the soldering process by providing additional contact points that resist the forces generated by solder flow, thereby preventing misalignment before it can occur.
3Stability of the object's composition
If solder flow is allowed to move freely during soldering, then complete coverage is achieved, but rotation and sliding of the apparatus occur causing misalignment
Solution Approach 1:
The patent employs asymmetry through the T-shaped configuration of the solder pad, where one edge extends beyond the others to create an asymmetric profile. This asymmetric extended edge acts as a mechanical stop that prevents rotation and sliding of the apparatus during soldering, while still allowing solder to flow and cover the entire pad surface area for complete electrical connection.
Data Source
AI summary
Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component.