Solder Resist Layer Structures for De-Featured Component Termination

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Solution Overview

Problem

In microelectronic structures, de-featured components' interconnects occupy valuable space on substrates due to termination on floating pads, increasing complexity and reducing efficiency in design and manufacturing.

Innovation Solution

Incorporating solder resist layer structures with conductive and non-conductive paste openings to terminate de-featured component interconnects, preventing electrical contact with the upper metallization layer and optimizing space usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If de-featured component interconnects are terminated on floating pads, then electrical isolation is achieved, but substrate space is wasted and design complexity increases

Engineering Contradiction:

Improveelectrical isolationVSAvoidsubstrate space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent extracts the electrical isolation function from the traditional floating pad structure and relocates it to the solder resist layer. By forming non-conductive paste structures within the solder resist layer, the isolation function is separated from the substrate plane, allowing substrate space to be reused for other purposes while maintaining the required electrical isolation for de-featured components.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions the isolation mechanism from a two-dimensional substrate plane (floating pads) to a three-dimensional structure using the solder resist layer. The non-conductive paste is formed within the thickness of the solder resist layer, effectively moving the isolation function to a different dimensional plane and enabling space optimization on the substrate surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If de-featured component interconnects are terminated on floating pads, then electrical isolation is achieved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectrical isolationVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the electrical isolation function with the existing solder resist layer structure. Instead of adding separate floating pad structures, the isolation is achieved by forming non-conductive paste patterns within the solder resist layer during the same manufacturing process, thereby combining multiple functions into a single integrated structure and reducing overall manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The solder resist layer is given multiple functions: it provides solder protection, structural support, and now also electrical isolation for de-featured components. The non-conductive paste within the solder resist layer enables the same layer to serve both as a protective coating and as an isolation mechanism, reducing the need for additional dedicated structures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Area of stationary object

If solder resist layer structures are used to terminate de-featured components, then substrate space is optimized, but manufacturing process complexity increases

Engineering Contradiction:

Improvesubstrate spaceVSAvoidmanufacturing process complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent incorporates the isolation structures into the solder resist layer formation process itself. By preparing the non-conductive paste patterns and integrating them during the solder resist application and curing steps, the isolation structures are created in advance as part of the standard manufacturing flow, avoiding the need for additional post-processing steps or complex assembly operations.

Inventive Principle:

Principle #10Preliminary action

4Reliability

If traditional floating pads are used for de-featured components, then electrical isolation is provided, but space efficiency decreases

Engineering Contradiction:

Improveelectrical isolationVSAvoidspace efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent applies electrical isolation properties locally within the solder resist layer at specific locations corresponding to de-featured components. The non-conductive paste is selectively formed only where isolation is needed, while other areas of the substrate remain fully available for active components and interconnects, thereby achieving localized isolation without sacrificing overall space efficiency.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS10244632B2Solder resist layer structures for terminating de-featured components and methods of making the same

Publication Date: 2019.03.26 INTEL CORP

AI summary

A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.