Display Module Bending Alignment via Protrusion-Via Engagement

The patent applies preliminary action by pre-defining alignment marks and via holes at specific positions on the back plate layer before the bending process. The alignment marks are positioned at predetermined locations that correspond to the desired bending position, and via holes are created at these marked positions. This preliminary preparation ensures that when the bending region is bent, it can be accurately aligned with the via holes and alignment marks, thereby guaranteeing precise bending position and angle without requiring complex alignment procedures during the bending process itself.

The patent applies self-service by designing a system where the back plate layer itself provides the alignment functionality through integrated alignment marks and via holes. The alignment marks are directly formed on the back plate layer, and the via holes are created at positions corresponding to these marks. During bending, the bending region automatically aligns with the via holes and alignment marks without requiring external alignment tools or complex procedures. This self-aligning mechanism maintains manufacturing simplicity while ensuring precise bending accuracy.

The patent applies local quality by creating a localized bending region with specific geometric characteristics. The bending region is designed with a controlled radius (greater than 0.4 mm and less than 0.6 mm) that is optimized for both stress distribution and alignment accuracy. The via holes and alignment marks are concentrated in this localized bending region, providing precise alignment references exactly where needed. This localized approach allows the bending region to maintain appropriate stress levels while achieving high bending position accuracy through the concentrated alignment features.