Laser Track Etching for Symmetrical Rectangular Holes
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Solution Overview
Problem
The existing processes for forming holes with special shapes, such as rectangular or polygonal, in multilayer circuit structures require improvements to achieve more symmetrical profiles and reduce etching time.
Innovation Solution
A method involving laser processing to create laser tracks with specific patterns on a substrate, followed by etching to form holes with desired shapes, allowing for the formation of holes with special shapes and improving the symmetry of their profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional hole formation processes are used for special shapes, then holes can be formed in multilayer circuit structures, but the profile symmetry is poor and etching time is excessive
Solution Approach 1:
The patent applies laser processing to pre-form laser tracks in the substrate before the etching process. These laser tracks create a modified material structure that guides the subsequent etching process, enabling the formation of holes with special shapes (rectangular, polygonal) while achieving symmetrical profiles and reducing etching time. The preliminary laser action prepares the material in advance for controlled removal.
2Adaptability or versatility
If circular through via holes are used, then the manufacturing process is simple and reliable, but special shape requirements cannot be met
Solution Approach 1:
The patent replaces conventional mechanical drilling or punching methods with laser processing followed by etching. The laser beam can be precisely controlled to create tracks of any desired shape pattern (rectangular, polygonal, or other custom shapes) without requiring mechanical tooling changes, thus achieving shape versatility while maintaining process simplicity.
3Shape
If multiple overlapping laser tracks are used to form special shape holes, then the desired shape can be achieved, but the processing complexity increases
Solution Approach 1:
The patent segments the hole formation process into two distinct stages: first, laser processing creates multiple non-overlapping laser tracks that define the hole perimeter; second, etching removes material between and around these tracks to form the final hole shape. This segmentation simplifies the laser tracking requirement compared to forming the entire hole shape in a single laser pass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of holes with special shapes, such as rectangular or polygonal, with more symmetrical profiles and potentially reduced etching time, leading to improved manufacturing efficiency.
Implementation Method 1
laser processing the predetermined first hole region from the first surface to form a first laser track, and laser processing the predetermined first hole region from the first surface to form a second laser track
Implementation Method 2
etching the predetermined first hole region to form a first hole
Data Source
AI summary
A method of manufacturing an electronic device includes providing a substrate with a predetermined first-hole region, a first surface, and a second surface. The second surface is opposite the first surface. The method includes laser processing the predetermined first-hole region from the first surface to form a first laser track and laser processing the predetermined first-hole region from the first surface to form a second laser track. The first laser track does not overlap the second laser track. The method further includes etching the predetermined first-hole region to form a first-hole.