Metallic Glass Heat Dissipation Material for LED Junctions
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Solution Overview
Problem
Light emitting diodes (LEDs) face inefficiencies due to high thermal loss at the junction point, leading to reduced luminance and shortened lifespan, as existing heat dissipation materials and soldering methods are inadequate for effectively managing heat in these devices.
Innovation Solution
A heat dissipation material comprising a metallic glass with a supercooled liquid region and thermal conductive particles is used, which includes alloys such as aluminum and copper, and an organic vehicle to enhance thermal conductivity and form junction points with low viscosity, allowing for efficient heat dissipation and improved processing temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat dissipation materials are used in LED junction parts, then the device structure is simple and manufacturing is easy, but thermal loss is high leading to reduced luminance and lifespan
Solution Approach 1:
The patent employs a composite material consisting of metallic glass particles dispersed in a solder matrix (e.g., Sn-Ag-Cu alloy). The metallic glass component (containing elements like Al, Ti, Ni, Zr, Fe, Mg, Ca, Co, Pd, Pt, Au, Ce, La, Y, Gd, Be, Ta, Ga, Hf, Nb, Pb, P, B, Si, C, Sn, Mo, W, Mn, Er, Cr, Pr, Tm) provides superior thermal conductivity and mechanical properties, while the solder matrix ensures ease of manufacturing and bonding. This composite structure reduces thermal loss at the LED junction part while extending device lifespan through improved heat dissipation.
Solution Approach 2:
The patent utilizes the glass transition temperature (Tg) and crystallization temperature (Tc) characteristics of metallic glass to optimize processing parameters. By controlling the heating temperature within the supercooled liquid region (between Tg and Tc), the metallic glass exhibits liquid-like behavior that facilitates forming and bonding operations. This parameter control enables effective heat dissipation material application while maintaining manufacturing feasibility, thereby reducing thermal loss and improving reliability.
2Temperature
If metallic glass with supercooled liquid region is used, then heat dissipation characteristics are improved, but processing temperature control becomes more critical
Solution Approach 1:
The patent exploits the glass transition temperature (Tg) and crystallization temperature (Tc) of metallic glass to define a supercooled liquid region where the material exhibits liquid-like behavior. By controlling processing temperatures within this specific range (Tg < Tprocessing < Tc), the metallic glass becomes sufficiently fluid for forming and bonding operations while maintaining its superior thermal conductivity. This parameter-based approach enables effective heat dissipation with manageable processing requirements.
Solution Approach 2:
The composite structure of metallic glass particles in a solder matrix provides a practical solution for processing. The solder matrix (e.g., Sn-Ag-Cu alloy) has well-established processing characteristics and eutectic melting points that facilitate conventional soldering techniques. The metallic glass particles dispersed within this matrix benefit from the matrix's processing ease while contributing enhanced thermal conductivity, thus improving heat dissipation without excessive processing complexity.
3Illumination intensity
If higher thermal conductivity material is used, then junction temperature is reduced and luminance increases, but material selection and manufacturing complexity increase
Solution Approach 1:
The patent uses a composite material system where metallic glass particles (providing high thermal conductivity) are dispersed in a conventional solder matrix (providing ease of manufacturing). The metallic glass component contains multiple elements (Al, Ti, Ni, Zr, Fe, Mg, Ca, Co, Pd, Pt, Au, Ce, La, Y, Gd, Be, Ta, Ga, Hf, Nb, Pb, P, B, Si, C, Sn, Mo, W, Mn, Er, Cr, Pr, Tm) that can be selected and optimized based on specific thermal conductivity requirements, while the solder matrix maintains compatibility with existing manufacturing processes, thus increasing luminance without excessive complexity.
Solution Approach 2:
The patent applies the high thermal conductivity metallic glass specifically at the LED junction part where heat generation is most intense. This localized application of advanced material properties addresses the critical heat dissipation need at the light source while allowing other parts of the LED package to use conventional materials, thereby improving luminance through targeted material optimization without comprehensively increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of this heat dissipation material reduces junction temperatures, increasing light emission and extending the lifespan of LEDs by up to double, while offering equivalent thermal conductivity to conventional metal solders with improved processing advantages.
Implementation Method 1
A heat dissipation material comprising a metallic glass with a supercooled liquid region and thermal conductive particles is used, which includes alloys such as aluminum and copper, and an organic vehicle to enhance thermal conductivity
Implementation Method 2
The supercooled liquid region may be a temperature region between a glass transition temperature and a crystallization temperature of the metallic glass, and the metallic glass may have a liquid-like behavior in the supercooled liquid region
Implementation Method 3
The metallic glass may have a supercooled liquid region ranging from about 5° C. to about 200° C.
Data Source
AI summary
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.