Multi-layer PCB with Protruding Heat Poles for Thermal Dissipation
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Solution Overview
Problem
Conventional multi-layer printed circuit boards (PCBs) face challenges in efficiently dissipating heat generated from power semiconductor modules, leading to increased risk of fire and limitations in using high currents due to complex heat dissipation structures and bulkiness, which hinder the achievement of slimness and high density in electronic devices.
Innovation Solution
A high-power multi-layer PCB design that incorporates a conductive plate with protruding heat poles, allowing for direct heat absorption and dissipation from both the PCB and power semiconductor module package, while also serving as a current line, using thermally conductive materials like copper, aluminum, silicon carbide, or aluminum nitride, and integrating the heat dissipation structure within the PCB to reduce fire risk and enable high current usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If PCBs are stacked one on another in sequence, then the PCB structure is compact and space-efficient, but heat generated from internal PCBs cannot be efficiently discharged leading to fire risk
Solution Approach 1:
The patent merges the heat dissipation structure with the PCB substrate itself, creating an integrated thermal management solution. The PCB includes internal heat dissipation channels and external heat dissipation structures that are formed as part of the PCB manufacturing process, eliminating the need for separate heat dissipation components while effectively conducting heat away from internal layers.
Solution Approach 2:
The patent introduces vertical heat dissipation channels that extend through the thickness of the PCB, allowing heat to escape in the vertical dimension rather than only laterally. This dimensional approach enables internal heat sources to discharge heat through external surfaces without requiring increased lateral spacing between PCB layers.
2Object-affected harmful factors
If a heat dissipation structure is installed on the outside of the power semiconductor module package, then heat can be discharged, but the product structure becomes complicated and slimness is compromised
Solution Approach 1:
The heat dissipation structure is merged with the PCB substrate, forming an integrated assembly where the PCB serves both as the circuit carrier and the heat dissipation component. This eliminates the need for separate heat dissipation structures attached to the power semiconductor module, simplifying the overall product structure while maintaining effective heat discharge capability.
Solution Approach 2:
The PCB substrate is designed to perform multiple functions simultaneously: electrical circuit functionality, mechanical support, and thermal management. By incorporating heat dissipation channels and structures directly into the PCB, the same component serves both signal transmission and heat dissipation purposes, reducing overall system complexity.
3Object-affected harmful factors
If a heat dissipation structure is installed on the outside of the power semiconductor module package, then heat can be discharged, but the product volume increases reducing high density achievement
Solution Approach 1:
The heat dissipation functionality is merged into the existing PCB substrate volume, eliminating the need for additional external heat dissipation structures. The PCB's internal layers and external surfaces are utilized as heat dissipation pathways, ensuring that heat discharge capability is achieved without increasing the overall product volume.
Solution Approach 2:
The patent utilizes the vertical dimension of the PCB structure by creating through-substrate heat channels that allow heat to escape perpendicular to the PCB surface. This approach enables effective heat dissipation without requiring increased lateral dimensions, thereby maintaining compact product volume while achieving high density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated from both the PCB and power semiconductor module package, reducing the risk of fire and allowing for the use of high currents, while achieving slimness and high density in electronic devices by integrating heat dissipation within the PCB structure.
Implementation Method 1
a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate 10, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto
Data Source
AI summary
The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.