Angled Spacer Layout for Thinner Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor devices face challenges in enhancing the degree of freedom of arrangement on a substrate, particularly due to the limitations in spacer design which can lead to increased thickness and reduced flexibility in component placement.
Innovation Solution
The semiconductor device incorporates spacers with angled surfaces, specifically trapezoidal or parallelogram shapes, allowing for enhanced arrangement flexibility by minimizing contact with adjacent components and increasing the filling rate of sealing resin, thereby reducing the overall device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional rectangular spacers are used, then manufacturing is simple, but the degree of freedom of arrangement on substrate is limited and device thickness increases
Solution Approach 1:
The spacer is designed with an asymmetric cross-sectional shape (trapezoidal or parallelogram) where one surface is inclined at an angle different from 45 degrees relative to the vertical direction. This asymmetric geometry enables better arrangement flexibility on the substrate while reducing the overall device thickness compared to conventional symmetric rectangular spacers.
Solution Approach 2:
The invention changes the geometric parameters of the spacer by specifying that the inclined surface forms an angle of 0 to 89.9 degrees with the vertical direction, optimizing the balance between arrangement freedom and device thickness. This parameter optimization allows the spacer to fit more efficiently in three-dimensional stacked configurations.
2Reliability
If spacers with large contact area are used, then mechanical support is improved, but the filling rate of sealing resin decreases
Solution Approach 1:
The spacer design concentrates the mechanical support function at specific localized regions through its inclined surface geometry, while leaving other regions with reduced material presence. This allows adequate mechanical support where needed while maximizing the space available for sealing resin infiltration, thereby improving both reliability and resin filling rate.
3Productivity
If spacers are positioned close to semiconductor chips, then arrangement density is improved, but risk of stress and chipping increases
Solution Approach 1:
The asymmetric inclined surface of the spacer creates a natural stress distribution pattern that directs mechanical stresses away from the semiconductor chip edges. By positioning the inclined surface appropriately, the spacer provides close proximity for high arrangement density while the geometric configuration minimizes stress concentration that could lead to chip chipping.
Data Source
AI summary
A semiconductor device includes a substrate, a spacer, and a first member. The spacer is disposed on the substrate, and has (i) a first surface facing the substrate, (ii) a second surface opposite to the first surface, and (iii) a third surface, at least part of the third surface forming an angle of less than 90 degrees with respect to the second surface. The first member is disposed on the substrate and, when viewed in a first direction from the substrate toward the spacer, at least partly overlaps the spacer. The first member is not in contact with the spacer.