Angled Substrate Integration in Fan-Out Wafer Level Packages
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Solution Overview
Problem
The complexity and cost of manufacturing face-up and face-down Fan Out Wafer Level Packages (FOWLPs) increase when additional passive components are added, due to the need for additional operations and RDL connections, leading to higher risks of yield loss.
Innovation Solution
A package design that includes a die with a substrate and interconnects oriented at an angle greater than 10 degrees, coupled with a redistribution layer, and a mold compound to simplify the integration of passive components without increasing interconnection complexity, allowing for face-up and face-down configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional passive components are added to the package, then the functionality and performance of the package are improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the passive component and the substrate into a single integrated structure. The substrate serves dual purposes: as the mounting platform for the passive component and as the interconnection carrier. This integration eliminates the need for separate mounting operations and reduces the number of discrete components that need to be handled during manufacturing.
Solution Approach 2:
The passive component is pre-mounted onto the substrate before the substrate is attached to the die. This preliminary action allows the passive component to be positioned and connected to the substrate interconnects in advance, simplifying the final assembly process and reducing the number of steps required during package manufacturing.
2Adaptability or versatility
If additional passive components are added to the package, then the functionality of the package is improved, but the risk of yield loss increases
Solution Approach 1:
By integrating the passive component directly onto the substrate, the patent reduces the number of separate assembly operations. Fewer discrete steps mean fewer opportunities for errors and defects, thereby reducing the overall risk of yield loss while maintaining enhanced functionality.
Solution Approach 2:
The passive component is pre-assembled on the substrate in a controlled manner before final package assembly. This preliminary positioning ensures proper alignment and connection, reducing the likelihood of defects during subsequent manufacturing steps and improving overall yield.
3Ease of manufacture
If the substrate is oriented at an angle greater than 10 degrees relative to the die face, then the integration of passive components is simplified, but the structural alignment complexity increases
Solution Approach 1:
The patent employs an asymmetric orientation of the substrate relative to the die face, with the substrate angled greater than 10 degrees. This asymmetric configuration optimizes the spatial arrangement for passive component integration while the carrier provides a stable platform that manages the alignment requirements during manufacturing.
Solution Approach 2:
The carrier serves as an intermediary structure that holds both the die and the angled substrate assembly. This mediator provides a stable reference frame that simplifies the alignment process, allowing the substrate to be positioned at the optimal angle for passive component integration without increasing overall alignment complexity.
Data Source
AI summary
A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.