Angled Venting Channel in Optoelectronic Device Cover

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Solution Overview

Problem

Optoelectronic devices face pressure increases in cavities due to heating, as expanding air lacks a suitable venting mechanism, potentially leading to clogging and operational issues during manufacturing.

Innovation Solution

Incorporating a channel in the cover that extends perpendicular to the substrate, allowing heated air to escape and preventing pressure buildup, while ensuring the channel's exit is remote from the substrate to avoid debris and fluid ingress during manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a venting hole is provided at the bottom side of the cover in a direction parallel to the substrate, then air can escape from the cavity to prevent pressure increase, but debris and water may enter and clog the venting hole during manufacturing

Engineering Contradiction:

Improveventing functionVSAvoiddebris clogging

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent inverts the conventional venting hole orientation by extending the channel in a direction not parallel to the substrate (at an angle of 25°-90°), with the exit remote from the substrate. This inversion prevents debris and water from entering the channel during substrate cutting operations, while still allowing heated air to escape from the cavity effectively.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions from a two-dimensional planar venting hole (parallel to substrate) to a three-dimensional angled channel extending through the cover thickness. The channel exits at a position remote from the substrate surface, creating a spatial separation that prevents contamination while maintaining venting functionality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the channel exit is positioned close to the substrate for easy manufacturing, then manufacturing is simplified, but debris and water can easily enter and clog the channel

Engineering Contradiction:

Improvechannel fabricationVSAvoidcontaminant ingress

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

Instead of positioning the channel exit close to the substrate for manufacturing convenience, the patent inverts the approach by positioning the exit remote from the substrate. The angled configuration (25°-90°) balances manufacturing feasibility with contamination prevention, as the exit position is naturally protected from debris and water during cutting operations.

Inventive Principle:

Principle #13The other way round (Inversion)

3Object-affected harmful factors

If a channel extending perpendicular to the substrate is used to prevent debris ingress, then contaminant entry is reduced, but the channel may require more complex manufacturing processes

Engineering Contradiction:

Improvedebris preventionVSAvoidchannel fabrication

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent optimizes the channel angle parameter within the range of 25°-90° relative to the substrate. This parameter adjustment allows flexibility in manufacturing: angles closer to 90° (perpendicular) provide better contamination protection, while angles closer to 25° may be easier to manufacture. The optimal angle balances both manufacturing ease and contamination prevention requirements.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively vents heated air, preventing pressure increases and reducing the risk of clogging, thereby enhancing the operational stability and manufacturing efficiency of optoelectronic devices.

Implementation Method 1

In operation, the optoelectronic semiconductor component may heat up. This may warm up the air in the cavity. In order to avoid or reduce an increase of pressure in the cavity caused by the heated air, the air must be able to expand without causing a substantial pressure increase.

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

In the optoelectronic device, air which heats up in the cavity during the operation of the optoelectronic device can leave the cavity and flow through the channel to the outside.

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11563153B2Optoelectronic device having a cover including channel

Publication Date: 2023.01.24 OSRAM OPTO SEMICON GMBH & CO OHG

AI summary

An optoelectronic device includes a substrate, an optoelectronic semiconductor component being arranged on the substrate and having a light-emitting surface, preferably on the upper side of the optoelectronic semiconductor component, and a cover being arranged on the substrate for covering the optoelectronic semiconductor component, the cover providing a cavity which surrounds the optoelectronic semiconductor component when the cover is arranged on the substrate, the cover having at least one channel which extends along a first direction in the cover from the outside to the cavity, and the first direction being not parallel to the substrate and preferably extending at least approximately perpendicular to the substrate.