Dual-Chamber Annealing Cooling for Uniform Thermal Budgets
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Solution Overview
Problem
Current annealing equipment faces challenges in maintaining uniform annealing performance across different zones during the cooling stage, leading to non-uniform thermal budgets and extended cooling times, which can result in performance inconsistencies and increased processing time.
Innovation Solution
The proposed annealing apparatus features a dual-chamber structure with independently controlled gas inlets and vents in the outer chamber, allowing for the introduction of a buffer gas with lower temperatures during cooling, and zone-specific control of gas exchange rates to equalize temperature decreases across zones, ensuring uniform annealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional annealing equipment is used during the cooling stage, then the system structure remains simple, but non-uniform annealing performance and extended cooling times occur across different zones
Solution Approach 1:
The annealing apparatus is divided into an inner chamber and an outer chamber, with the outer chamber segmented into multiple zones (first zone and second zone) with independently controllable gas inlets and vents. This segmentation allows different cooling rates to be applied to different zones, resolving the contradiction by enabling uniform annealing performance across zones while managing the complexity through modular zone control.
Solution Approach 2:
Different zones of the outer chamber are assigned different gas exchange rates tailored to their specific thermal requirements. The first zone and second zone have independently controlled gas inlets and vents, allowing each zone to receive customized cooling conditions. This local quality approach ensures uniform annealing performance across different zones without requiring complete system redesign.
2Productivity
If conventional cooling methods are used, then the equipment operation remains simple, but cooling time is extended and thermal budget consistency is compromised
Solution Approach 1:
The gas exchange rates in the outer chamber are dynamically adjusted based on the thermal requirements of different zones. During the cooling stage, the controller modulates the gas flow through independently controlled gas inlets and vents in the first and second zones, enabling accelerated and uniform cooling. This dynamic control resolves the contradiction by achieving high cooling rates while managing operational complexity through automated zone-specific regulation.
Solution Approach 2:
The system employs feedback control where the controller monitors temperature conditions in different zones and adjusts gas exchange rates accordingly. This feedback mechanism ensures that cooling proceeds at optimal rates for thermal budget consistency while maintaining ease of operation through automated control, resolving the contradiction between productivity and ease of operation.
3Manufacturing precision
If uniform annealing performance is achieved through zone-specific control, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The outer chamber is segmented into multiple zones with independently controllable gas inlets and vents, allowing precise thermal budget control in each zone. This segmentation achieves uniform annealing performance by enabling zone-specific gas exchange rate adjustment, while the modular structure manages device complexity through standardized zone modules that can be controlled independently.
Solution Approach 2:
The outer chamber structure serves multiple functions: it provides thermal isolation, enables zone-specific cooling control, and maintains pressure differentials. By making the outer chamber multi-functional, the design achieves uniform thermal budgets across zones without proportionally increasing device complexity, as the same structural elements perform multiple roles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform annealing performance across different zones, reduces cooling time, and enhances the robustness of semiconductor fabrication processes by maintaining consistent thermal budgets, thereby improving processing efficiency and reducing manufacturing costs.
Implementation Method 1
a buffer gas in said outer chamber, wherein said buffer gas has a second temperature
Implementation Method 2
exchanging said buffer gas in said outer chamber while keeping a gas pressure difference between said first gas pressure and said second gas pressure within a tolerance limit
Data Source
AI summary
An annealing apparatus includes: a first chamber including a first gas having a first gas pressure; a second chamber configured to receive a second gas having a second gas pressure; gas inlets; gas vents; heating elements laterally surrounding the first chamber; and a controller configured to perform the steps of: heating the first chamber while keeping a gas pressure difference between the first gas pressure and the second gas pressure is within a tolerance limit; and cooling the first chamber by exchanging the second gas in the second chamber while keeping the gas pressure difference within the tolerance limit, wherein the exchanging of the second gas includes introducing the second gas to the second chamber through the plurality of gas inlets and exhausting a the second gas out of the second chamber through the plurality of gas vents while keeping the second gas pressure unchanged.