Annular Capacitor Cooling Loops for High-Density Controller Packaging
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Solution Overview
Problem
Existing heat dissipation devices for capacitors in drive motor controllers are inefficient, leading to increased volume and contradicting the trend towards high power density and miniaturization, while also affecting the service life and performance of capacitors due to high temperatures and ripple current.
Innovation Solution
An integrated heat dissipation device for annular capacitors featuring an annular accommodating cavity, dual heat dissipation loops, and flow distribution mechanisms that minimize volume increase and enhance heat dissipation efficiency by circulating coolant through multiple channels and loops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation devices are placed at the bottom or top of the capacitor, then heat dissipation function is provided, but the volume of the capacitor and drive motor controller increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing capacitor structure by integrating heat dissipation channels into the housing that surrounds the capacitor. The housing serves dual purposes: mechanical protection and thermal management. This merging eliminates the need for separate heat dissipation components, thereby providing effective heat dissipation without increasing the overall volume of the capacitor assembly.
Solution Approach 2:
The housing is designed to perform multiple functions: it provides mechanical support, electrical insulation, and heat dissipation. By making the housing multi-functional, the patent avoids adding separate components for each function, thus preventing volume increase while achieving effective heat dissipation through the integrated channels in the housing structure.
2Temperature
If traditional heat dissipation devices are used, then heat dissipation is provided, but the device complexity and volume increase contradicting high power density requirements
Solution Approach 1:
The patent merges the heat dissipation function into the existing housing structure, creating an integrated solution that eliminates separate heat dissipation devices. The housing contains internal channels that serve as heat dissipation pathways, reducing structural complexity and volume while maintaining effective thermal management for high power density applications.
Solution Approach 2:
The housing is designed as a multi-functional component that simultaneously provides mechanical support, electrical insulation, and thermal management. This universal design approach reduces the number of separate components needed, thereby decreasing device complexity and volume while achieving the required heat dissipation efficiency for high power density controllers.
3Productivity
If capacitors operate at high power and frequency, then rapid charging and discharging is achieved, but ripple current increases causing excessive heat generation
Solution Approach 1:
The patent employs fluid-based heat dissipation by circulating coolant through channels formed in the housing. This hydraulic approach efficiently removes heat generated by ripple current during high-power operation. The coolant flow through the housing channels provides continuous thermal management, enabling the capacitor to operate at high power and frequency without excessive temperature rise.
Solution Approach 2:
The patent changes the thermal management parameters by implementing active coolant circulation rather than passive heat dissipation. By controlling coolant flow rate and temperature, the system can dynamically adjust heat removal capacity to match the heat generation from ripple current during high-power operation, maintaining optimal operating temperature despite increased productivity demands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes volume increase, improves heat dissipation efficiency, and ensures stable coolant circulation, thereby enhancing the performance and longevity of capacitors in high-power density applications.
Implementation Method 1
a first heat dissipation loop arranged within the accommodating space, where the first heat dissipation loop is filled with a coolant
Implementation Method 2
the pair of flow distribution mechanisms are configured to extend in a direction away from the housing and respectively form an inlet channel and an outlet channel for circulating the coolant
Implementation Method 3
a second heat dissipation loop arranged outside the housing, where the second heat dissipation loop is configured to cooperate with the first heat dissipation loop to respectively exchange heat with on opposite sides of the core assembly
Data Source
AI summary
An integrated heat dissipation device for an annular capacitor is provided, including: an accommodating cavity with an annular structure formed inside a housing; a core assembly arranged within the accommodating cavity, and an accommodating space exists between the core assembly and the housing; a first heat dissipation loop arranged within the accommodating space, and filled with a coolant; a second heat dissipation loop arranged outside the housing, and configured to cooperate with the first heat dissipation loop to respectively exchange heat with opposite sides of the core assembly; and flow distribution mechanisms being respectively in communication with the first heat dissipation loop and the second heat dissipation loop.