Anti-rotation and fastening features let a DC choke align and lock onto a DC link capacitor without tools, reducing misalignment and detachment.
A 2×2 capacitor matrix with opposing sub-assemblies and shared busbars improves cooling contact and energy distribution in power electronics.
A flat cooling plate and insulating fill improve capacitor heat dissipation while preserving electrical isolation in liquid-cooled power electronics.
A metal end wall and insulating potting compound let film capacitors shed heat while preventing short circuits and extending service life.
Dual coolant loops and flow distribution cool both sides of an annular capacitor while limiting controller volume growth in high-power designs.
Opposed plate busbars beside film capacitor elements cut path inductance and losses, enabling smaller power converters without extra cooling.
Interleaved via bars between capacitor plates raise capacitance density without extra process steps or larger semiconductor area.
Phase-change chalcogenide capacitors give reconfigurable intelligent surfaces low-power dual-band phase tuning at 28 GHz and 110 GHz.
Integrated non-conductive, thermally conductive cooling channels dissipate heat inside wound capacitors to reduce hot spots and support inverter performance.
Multi-radius cutouts and a strap channel let one mount secure different capacitor sizes on-site while keeping wires organized.
Partitioned porous capacitance sections connected in series reduce electric field concentration and help prevent capacitor short circuits.
Vertical supports link horizontal layers to stop capacitor collapse during sacrificial layer removal and improve semiconductor yield.
Ribs and refrigerant channels isolate closely packed capacitors, improving cooling while limiting heat interference and leakage.
Segmented capacitance parts and discontinuous conductive films spread electric field stress to prevent shorts and raise withstand voltage.
Rigid insert-molded resin insulation replaces deformable sheets to improve busbar positioning accuracy, insulation reliability, and assembly cost.
A metal block with a large current-path cross section cuts joint heat between chip components and the land pattern while keeping mounting stable.