Capacitor Cooling Plate Layout for Thermal Contact and Electrical Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power electronic systems face challenges in efficiently coupling capacitor devices with liquid cooling devices, particularly in ensuring effective thermal and electrical insulation while maintaining direct thermal contact.
Innovation Solution
A power electronic system design featuring a cooling device with a first cooling contact surface perpendicular to the capacitor device, utilizing a flat cooling plate element in direct thermal contact, and incorporating insulation devices for electrical insulation, with the capacitor elements arranged in a matrix-like manner and housed in a cup-shaped partial housing filled with insulating agent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If direct thermal contact is established between cooling device and capacitor device, then heat dissipation efficiency is improved, but electrical insulation becomes more difficult to ensure
Solution Approach 1:
The patent introduces a cooling plate element as an intermediary component between the capacitor device and the cooling device. This cooling plate serves dual functions: it provides thermal conduction path for heat dissipation while simultaneously acting as an electrical insulator to prevent electrical breakdown. The cooling plate element is specifically designed with thermal conductivity properties that enable efficient heat transfer from capacitor elements while maintaining electrical isolation, thus resolving the contradiction between heat dissipation efficiency and electrical insulation reliability.
2Loss of energy
If cooling plate element is designed to cover large area of capacitor elements, then thermal contact efficiency is improved, but electrical insulation risk increases
Solution Approach 1:
The patent applies local quality principle by designing the cooling plate element with spatially varying properties. The cooling plate is configured to cover specific regions of the capacitor elements where thermal contact is most needed, while maintaining appropriate spacing and insulation distances in areas where electrical field strength is highest. This localized optimization allows maximum thermal contact efficiency in critical heat generation zones while preserving electrical insulation margins in high-voltage stress regions, thus resolving the contradiction between thermal contact efficiency and electrical insulation risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conductivity and electrical insulation, ensuring efficient heat dissipation and reliable operation of capacitor devices while minimizing thermal resistance and electrical interference.
Implementation Method 1
the cooling device has a first cooling contact surface with a normal direction, which is in direct thermal contact with the capacitor device
Implementation Method 2
the cup-shaped first partial housing is filled with an insulating agent until it reaches the cooling device and covers the capacitor device completely
Data Source
AI summary
A power electronic system is described, having a capacitor device and having a cooling device, wherein the cooling device has a first cooling contact surface with a normal direction, which is in direct thermal contact with the capacitor device, wherein the capacitor device has a first and a second element connecting device.