Metal Block Current Path for Cooler Chip Component Mounting
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Solution Overview
Problem
Conventional electronic devices with integrated chip components experience excessive heat generation due to increased current, leading to temperature rises.
Innovation Solution
Incorporation of a metal block with a large sectional area current path at the joint between the land pattern and chip components, aligned along a predetermined direction, to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If chip components are integrated with a substrate, then mounting complexity is reduced, but heat generation increases due to increased current
Solution Approach 1:
The patent extracts the heat dissipation function from the substrate by introducing a separate metal block structure. This metal block is specifically designed to provide a low-resistance current path and dissipate heat away from the integrated chip components, thereby resolving the heat generation issue while maintaining the integration benefits.
Solution Approach 2:
The metal block acts as an intermediary between the chip components and the substrate. It provides a dedicated current path that mediates the electrical connection while simultaneously serving as a heat sink, thus reducing heat generation at the joint without compromising the integrated mounting structure.
2Power
If current is increased to improve performance, then power delivery is enhanced, but temperature rise occurs due to excessive heat generation
Solution Approach 1:
The patent applies local quality by creating a specialized current path structure at the critical joint region. The metal block provides locally enhanced electrical conductivity and heat dissipation capability at the substrate-chip interface, allowing high current flow without excessive temperature rise in that specific location.
Solution Approach 2:
The patent changes the electrical and thermal parameters at the joint by introducing the metal block with optimized dimensions and material properties. This alters the resistance and heat generation characteristics of the current path, enabling high power delivery while controlling temperature rise through modified physical parameters.
3Loss of energy
If a metal block with large sectional area is added to reduce heat generation, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the metal block structure. It combines the current path function, heat dissipation function, and mechanical support function into a single integrated component, thereby improving heat dissipation without proportionally increasing overall device complexity.
Solution Approach 2:
The metal block is designed as a multi-functional element that simultaneously provides electrical connection, heat dissipation, and structural support. This universal approach allows a single component to address multiple requirements, reducing the need for additional separate components and minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal block reduces heat generation and prevents temperature rises by providing a large sectional area for current paths, ensuring stable mounting and efficient heat dissipation.
Implementation Method 1
the electrode-opposing surface being opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction, and the mounting surface being substantially perpendicular to the electrode-opposing surface
Implementation Method 2
the amount of heat generation at a joint between a land pattern of a circuit board and a conventional electronic device is relatively larger... the metal block capable of providing a current path having a large sectional area is disposed at a joint between the land pattern and this electronic device, the amount of heat generation can be reduced
Data Source
AI summary
An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.