2×2 Capacitor Assembly Layout for Thermal Integration
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Solution Overview
Problem
Existing capacitor arrangements in power-electronic systems are inefficient and lack optimal integration with cooling and power semiconductor modules, leading to suboptimal performance and thermal management.
Innovation Solution
A capacitor assembly with individual capacitors arranged in a 2×2 matrix, connected by busbars forming sub-assemblies, and integrated with a cooling device and power semiconductor module, utilizing symmetrically arranged connection elements and busbars for efficient energy and thermal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If capacitors are arranged in a conventional configuration, then the device structure is simple, but thermal management efficiency is insufficient
Solution Approach 1:
The capacitor assembly is segmented into a 2×2 matrix arrangement with distinct first and second sub-assemblies. Each sub-assembly contains capacitors with normals pointing in opposite directions (main direction and opposite main direction), creating modular units that can be independently managed for thermal optimization while maintaining overall structural organization.
Solution Approach 2:
The patent transitions from conventional linear or single-layer capacitor arrangements to a two-dimensional 2×2 matrix configuration. This dimensional change allows for optimized thermal pathways in multiple directions and improves integration with cooling devices by providing varied thermal contact surfaces across the assembly plane.
2Reliability
If capacitors are arranged in a 2×2 matrix with sub-assemblies, then thermal management is improved, but the device complexity increases
Solution Approach 1:
Capacitors within each sub-assembly are electrically connected through common connection elements. The first sub-assembly capacitors are connected via first connection elements, and the second sub-assembly capacitors are connected via second connection elements, merging individual capacitor functions into cohesive sub-assemblies that simplify the overall system architecture despite the increased spatial arrangement complexity.
Solution Approach 2:
The capacitor assembly design integrates multiple functions: electrical energy storage through individual capacitors, thermal management through optimized arrangement with cooling device contact, and structural organization through sub-assembly formation. This multi-functionality improves reliability by addressing multiple performance criteria simultaneously within a single integrated structure.
3Reliability
If connection elements are distributed across capacitor surfaces, then electrical connectivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
Connection elements are segmented and assigned to specific capacitors within each sub-assembly rather than being uniformly distributed across the entire assembly. This localization reduces the precision required for overall positioning while ensuring reliable electrical connectivity within each modular sub-assembly unit.
Solution Approach 2:
Capacitors within each sub-assembly are electrically connected to maintain equipotential relationships. The first sub-assembly capacitors are connected through first connection elements, and the second sub-assembly capacitors are connected through second connection elements, ensuring uniform electrical potential distribution that simplifies connectivity requirements compared to arbitrary distributed connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management and energy distribution, improving the performance and integration of capacitors within power-electronic systems, particularly in electric vehicles.
Implementation Method 1
all the first connection elements are connected to one another by means of a first busbar and wherein all the second connection elements are connected to one another by means of a second busbar
Implementation Method 2
a cooling portion of a capacitor connection device is in thermally conductive contact with a cooling surface of the cooling device
Data Source
AI summary
A capacitor assembly is presented, having a first to fourth individual capacitor each with a first top surface defining a respective normal direction of the individual capacitor and a second top surface opposite said first top surface, wherein the first top surface of the first individual capacitor defines a main direction, in each case first connection elements arranged on the first top surface and in each case second connection elements arranged on the second top surface, wherein the individual capacitors are arranged beside one another in a 2×2 matrix, wherein the normals of the first and second individual capacitor forming a first sub-assembly point in the main direction and wherein the normals of the third and fourth individual capacitor forming a second sub-assembly point opposite the main direction and wherein all the first connection elements are connected to one another by a first busbar and wherein all the second connection elements are connected to one another by a second busbar.