Anodized Metal Oxide Insulation for High Temperature Thermal Management
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Solution Overview
Problem
Conventional epoxy resin-based insulation layers are thermally weak and inadequate for high temperature conditions, leading to delamination and poor heat dissipation in electronic devices.
Innovation Solution
A metal oxide layer is formed through anodization of metals like Al, Ti, or Mg, deposited by PVD, and used as an insulation layer, which is more suitable for high temperature conditions and improves heat transfer properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used as an insulation layer, then electrical insulation is achieved, but thermal weakness causes delamination at high temperatures
Solution Approach 1:
The patent changes the material parameter from organic epoxy resin to inorganic metal oxide (such as aluminum oxide, titanium oxide, or silicon oxide), fundamentally altering the thermal and chemical stability parameters to withstand high temperature conditions while maintaining electrical insulation properties
Solution Approach 2:
The patent creates a composite structure by forming a metal oxide layer through anodization of a metal layer (Al, Ti, or Si) deposited on the substrate, combining the electrical conductivity control of metal with the insulating properties of its oxide form to achieve both electrical insulation and thermal stability
2Reliability
If epoxy resin is used as an insulation layer, then electrical insulation is provided, but heat dissipation capability is insufficient
Solution Approach 1:
The patent changes the material composition from carbon-based epoxy to metal oxide, which has superior thermal conductivity parameters, enabling effective heat dissipation while maintaining the required electrical insulation characteristics for electronic device operation
3Ease of manufacture
If solder resist is formed through liquid epoxy resin, then insulation pattern is created, but thermal transformation causes delamination
Solution Approach 1:
The patent transforms the material state from organic polymer (epoxy resin) to inorganic crystalline/amorphous oxide structure, which maintains compositional stability under thermal transformation conditions that would cause delamination of organic materials, while still allowing pattern formation through standard photolithography processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal oxide insulation layer effectively addresses thermal weaknesses of epoxy resin, ensuring reliable electrical insulation and enhanced heat dissipation in high temperature environments, such as in Wafer Level Package processes and LED applications.
Implementation Method 1
oxidizing the metal deposition layer by anodization to form a metal oxide layer
Implementation Method 2
depositing a metal selected from a group consisting of Al, Ti and Mg on the substrate with the conductive pattern formed thereon by PVD to form a metal deposition layer
Data Source
AI summary
An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.