Anodized Metal Substrate Module for LED Heat Radiation
Solution Overview
Problem
Conventional printed circuit boards (PCBs) used in backlight units and surface light source devices suffer from poor heat radiation properties, leading to reliability issues due to high heat resistance, while metal core PCBs with superior heat transfer properties are costly due to the use of high-cost polymer insulating layers.
Innovation Solution
An anodized metal substrate module is developed, featuring a metal plate with an anodized film and conductive lines on the film, where heat-generating devices like LEDs or power chips are mounted on selectively exposed areas of the metal plate, enhancing heat radiation with improved thermal conductivity and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional PCB with insulating base substrate is used, then manufacturing cost is low, but heat radiation properties are poor
Solution Approach 1:
The invention uses a metal core substrate (metal plate) instead of conventional insulating base substrates. The metal plate provides both structural support and superior heat radiation properties, eliminating the need for separate heat dissipation mechanisms while maintaining manufacturing feasibility.
Solution Approach 2:
The invention removes the insulating base substrate layer entirely and replaces it with a metal plate that serves both as structural support and heat radiation medium. This extraction of the insulating layer eliminates the thermal barrier while maintaining electrical insulation through alternative means (conductive lines on anodized film).
2Temperature
If a metal core PCB is used to improve heat transfer, then heat radiation properties are superior, but manufacturing cost increases due to high-cost polymer insulating layer
Solution Approach 1:
The invention replaces expensive polymer insulating layers with a simple anodized film coating on the metal plate. The anodized film is formed through an electrochemical process that creates a thin, inexpensive oxide layer that provides both insulation and surface functionality.
Solution Approach 2:
The invention replaces the mechanical polymer insulating layer with an anodized film formed through electrochemical processing. This substitution eliminates the need for separate insulating material application steps while providing both electrical insulation and heat radiation functionality.
3Temperature
If anodized film is formed on metal plate to selectively expose portions, then heat radiation is improved, but manufacturing process complexity increases
Solution Approach 1:
The invention applies anodized film selectively to specific regions of the metal plate where electrical insulation is needed, while leaving other regions exposed for direct heat transfer and device mounting. This localized application optimizes both electrical insulation and thermal management in different areas.
Solution Approach 2:
The invention controls the anodization process parameters (electrolyte composition, voltage, time) to create film thickness and porosity variations that optimize both electrical insulation properties and thermal radiation characteristics for different application requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anodized metal substrate module significantly improves heat radiation properties and manufacturing efficiency, enabling high-quality surface light source devices and backlight units with enhanced light efficiency and reduced costs compared to conventional PCBs and metal core PCBs.
Implementation Method 1
anodized film formed on the metal plate
Implementation Method 2
superb heat transfer properties
Data Source
AI summary
An anodized metal substrate module superior in heat radiation properties and reduced in manufacturing costs. A metal plate is provided. An anodized film is formed on the metal plate. A heat generating device is mounted on the metal plate. Also, a conductive line is formed on the anodized film.