Anodized Oxide Multilayer Ceramic Substrate Thermal Stability
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Solution Overview
Problem
Multilayer ceramic substrates used in probe cards face challenges with thermal deformation due to polyimide resin layers having high thermal expansion coefficients, which affect the accuracy of semiconductor inspections.
Innovation Solution
A multilayer ceramic substrate design incorporating a first insulating portion made of ceramic material with tungsten via conductors and internal wiring, and a second insulating portion made of anodized oxide material with copper via conductors, connected through solder bumps that penetrate into pores in the anodic oxide film to harden and secure the layers, reducing thermal expansion and enhancing electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polyimide resin layers are used in multilayer ceramic substrates, then ease of manufacture is improved, but thermal expansion coefficient increases causing thermal deformation
Solution Approach 1:
The patent uses a composite structure combining ceramic substrate layers with metal wiring layers embedded therein. The ceramic material provides low thermal expansion coefficient while the metal wiring provides electrical conductivity, creating a composite that achieves both thermal stability and electrical functionality without using polyimide resin.
Solution Approach 2:
The patent extracts and removes the polyimide resin layer from the multilayer structure, replacing it with a ceramic-based insulating layer. This elimination of the problematic resin material directly addresses the thermal expansion issue while maintaining the multilayer wiring functionality through alternative ceramic insulation methods.
2Stability of the object's composition
If tungsten wiring is used in multilayer ceramic substrate, then thermal expansion stability is improved, but electrical conductivity decreases
Solution Approach 1:
The patent applies different materials to different functional requirements within the same structure: tungsten is used specifically for via conductors where thermal stability is critical, while copper or aluminum is used for internal wiring layers where electrical conductivity is the primary requirement. This localized material assignment optimizes both thermal stability and electrical conductivity.
Solution Approach 2:
The patent creates a composite wiring system combining multiple metal materials (tungsten, copper, aluminum) within the ceramic substrate structure. Each material is strategically placed to fulfill its optimal function: tungsten for mechanical stability in vias, copper/aluminum for high conductivity in wiring paths, achieving overall system optimization.
3Reliability
If anodized oxide material with pores is used for insulation, then electrical insulation is improved, but structural stability decreases requiring additional fixing
Solution Approach 1:
The patent utilizes anodized oxide material with controlled porosity as an insulating layer. The porous structure provides excellent electrical insulation properties while the patent addresses the structural stability issue through additional bonding layers or filling materials that penetrate and anchor into the pore structure, combining the benefits of porosity for insulation with mechanical interlocking for stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a low thermal expansion coefficient and high electrical conductivity, securely fixing the insulation portion and preventing thermal deformation, thereby improving the accuracy of semiconductor inspections.
Implementation Method 1
a second insulating portion including a body of an anodized oxide material
Implementation Method 2
a portion of the solder bump is melted to be penetrated into the pore and then hardens
Implementation Method 3
a portion of the solder bump is melted to be penetrated into the pore and then hardens
Data Source
AI summary
A multilayer structure includes a first insulating layer including a first body of an anodized oxide material, a first via conductor penetrating through the first body, and a first internal wiring layer electrically connected to the first via conductor, a second insulating layer including a second body of the anodized oxide material, a second via conductor penetrating through the second body, and a second connection pad electrically connected to the second via conductor, and a solder hump provided on one of the first internal wiring layer and the second connection pad and between the first insulating layer and the second insulating layer. The first via conductor, the first internal wiring layer, the second connection pad, and the second via conductor are electrically connected to each other through the solder bump.