Porous Dielectrics TRIZ Cases
- Sensor Wound Dressing Encapsulation for Moisture-Safe Tissue Monitoring
Biocompatible hydrophobic encapsulation protects embedded wound-dressing electronics while enabling real-time tissue monitoring.
- Porous Rewiring Layer Structure for Thermal-Cycle-Resistant Modules
Coordinated pore sizes in the rewiring conductor and insulating layer cut thermal expansion mismatch and reduce module degradation under thermal cycling.
- Power Module Substrate Heat Sink Structure for Low Warping
An Al-impregnated SiC heat sink and thicker metal layer reduce thermal-expansion warping, protecting ceramic boards in power cycling.
- Liquid-Infused Encapsulation for Flexible Water-Sensitive Electronics
A liquid-infused polymer coating blocks water diffusion while preserving flexibility and extending stability in water-sensitive electronics.
- Distributed Filtering Cable Structure for High-Frequency Signal Control
Etched defective conductor layers turn the cable itself into a distributed filter, improving high-frequency filtering without bulky connectors.
- Hydrophobic Encapsulation for Sensorized Wound Dressings
A biocompatible hydrophobic coating encapsulates wound-dressing electronics to block fluid ingress while enabling real-time tissue monitoring.
- Stretchable Thin-Film Electronics on Heterogeneous Soft Substrates
Heterogeneous soft and stiff substrate domains localize strain, helping fragile thin films stretch without cracking or losing conductivity.
- Display Cushion Plate Coating for Through-Hole Mura Reduction
A nickel-coated porous cushion plate evens light transmittance around display through-holes to reduce mura and improve visibility.
- Cavity PCB Structure for Lower Dielectric Loss in RF Transmission
Air-cavity and filler regions in a plated PCB lower dielectric constant and loss, improving RF signal transmission while controlling cost.
- Ceramic Wiring Board Conductor Structure for Stronger Layer Adhesion
A dense-non-dense-dense conductor layer with silica particles improves ceramic board adhesion, conductivity, and thermal stress resistance.
- Porous Liquid Crystal Polymer Sheet for Stable PCB Dielectrics
Higher melt viscosity keeps pores from collapsing during pressure bonding, preserving high-frequency dielectric performance in circuit boards.
- Exposed Porous Inlay Structure for Cooling Dense Component Carriers
A gas-permeable porous inlay exposes airflow paths that improve heat dissipation, EMI shielding, and robustness in dense component carriers.
- Flexible Wiring Boards With Porous Sintered Metal, No Photolithography
Resin-filled voids in sintered metal wiring improve adhesion without photolithography.
- Low Thermal Conductivity Circuit Board with Interlayer Thermal Barrier
An interlayer thermal barrier reduces heat transfer between conductive layers, protecting heat-sensitive elements from thermal damage.
- Elastomeric Wearable Circuitry for Skin Contact
Laser etching and plating embed circuits in elastomeric substrates, maintaining stable skin contact for biosensors.
- Embedded Capacitor Module Using Solid Electrolyte for High-Capacitance Decoupling
Solid electrolytic capacitor structure embedded in substrate increases capacitance to hundreds of uF while reducing equivalent series inductance.
- Structured Thin Film Production Using Porous Sacrificial Layer
Applying a porous sacrificial layer and removing it via liquid jet reduces process complexity and waste in structured thin film manufacturing.
- Porous Film Copper Clad Laminate for High-Frequency PCBs
A porous film made from polyamic acid and multi-isocyanate integrates into copper clad laminates.
- Ceramic-Polymer Composite PCB for Thin Profile Rigidity
A co-continuous ceramic and polymer composite infiltrates porous sintered structures to form a stiff, crack-arresting skeleton.
- Insulating Substrate Edge Porosity for Image Sensor Light Noise
A mounting board with lower porosity at the opening edge blocks incident light from reaching the imaging element.