Liquid-Infused Encapsulation for Flexible Water-Sensitive Electronics

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Solution Overview

Problem

Current encapsulation methods for water-sensitive electronic materials and devices, such as perovskite photovoltaic cells, fail to provide long-term protection against water and environmental factors like UV light and mechanical stress, leading to degradation and short operational stability.

Innovation Solution

A liquid-based encapsulation system using a polymer coating infused with encapsulating liquids that form a multi-layered, self-healing, and slippery overlayer, preventing water diffusion and maintaining mechanical flexibility, with periodic replenishment to maintain effectiveness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional encapsulation methods are used for water-sensitive electronic materials, then manufacturing is simpler, but operational stability and protection against water/environmental factors deteriorates

Engineering Contradiction:
Improveoperational stabilityVSAvoidencapsulation system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a composite encapsulation system consisting of a polymer coating material infused with encapsulating liquid, forming a multi-layered structure with an overlayer. This composite approach combines the benefits of polymer structural integrity with the water-repellent properties of the encapsulating liquid, achieving superior protection against water and environmental factors while maintaining manufacturing feasibility

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The encapsulating liquid acts as an intermediary substance that mediates between the water-sensitive electronic material and the external environment. It provides a protective interface that prevents direct contact between water/moisture and the electronic material, while allowing the polymer coating to maintain its structural function

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If encapsulation provides strong water protection, then water diffusion prevention improves, but mechanical flexibility deteriorates

Engineering Contradiction:
Improvewater protectionVSAvoidmechanical flexibility
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent utilizes a polymer coating material that forms a flexible, thin-film encapsulation structure. This flexible coating infused with encapsulating liquid provides both water protection and mechanical flexibility, allowing the encapsulated electronic material to maintain bendability and structural adaptability while being protected from water diffusion

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical state of the encapsulation system by introducing an encapsulating liquid into the polymer coating matrix. This parameter change from solid-only encapsulation to liquid-infused solid encapsulation provides both water repellency and maintains the flexibility of the polymer structure, resolving the contradiction between protection and flexibility

Inventive Principle:
Principle #35Parameter changes

3Reliability

If encapsulation is applied to protect electronic materials, then protection effectiveness improves, but ease of manufacture deteriorates

Engineering Contradiction:
Improveprotection effectivenessVSAvoidmanufacturing simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by forming the polymer coating material on the electronic material surface first, then infusing it with the encapsulating liquid in a subsequent step. This sequential approach allows for simplified manufacturing where the coating formation and liquid infusion are separate, manageable processes that can be integrated into existing fabrication workflows

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The liquid-based encapsulation system significantly enhances the operational stability of water-sensitive materials by preventing water and environmental damage, maintaining mechanical integrity, and extending the lifespan of devices like perovskite photovoltaic cells beyond current benchmarks.

Implementation Method 1

an encapsulating liquid disposed over an entirety of the exposed surfaces of the electronic material to prevent diffusion of water past the encapsulating liquid and to protect the electronic material from water

Methodology Applied
Scientific EffectHydrophobe: Hydrophobe

Implementation Method 2

a coating material infused with the encapsulating liquid

Methodology Applied
Scientific EffectAbsorption (physical): Absorption (physical)

Data Source

PatentUS20240203807A1Fluid-infused encapsulation of water-sensitive materials with replenishable, multiscale water repellency
Publication Date: 2024.06.20 PRESIDENT & FELLOWS OF HARVARD COLLEGE
  • US20240203807A1 patent drawing
  • US20240203807A1 patent drawing
  • US20240203807A1 patent drawing

AI summary

In one aspect, a liquid-based encapsulation system includes an electronic material having a plurality of exposed surfaces; and an encapsulating liquid disposed over an entirety of the exposed surfaces of the electronic material to prevent diffusion of water past the encapsulating liquid and to protect the electronic material from water. In one aspect, a method of making a liquid-based encapsulation system includes providing an electronic material having a plurality of exposed surfaces; and encapsulating the electronic material with an encapsulating liquid over an entirety of the exposed surfaces of the electronic material to prevent diffusion of water past the encapsulating liquid and to protect the electronic material from water.