Ceramic Wiring Board Conductor Structure for Stronger Layer Adhesion
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Solution Overview
Problem
The adhesion between the insulation layer and conductor layer in conventional wiring boards is insufficient, leading to potential separation and peeling issues.
Innovation Solution
A wiring board design featuring a conductor layer with a layered structure comprising dense, non-dense, and dense layers, and incorporating nano-sized silica particles on the conductor layer surface to enhance adhesion and stress relief, while using a specific manufacturing process to ensure proper sintering and reduce void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional conductor layer is used without layered structure, then the manufacturing process is simple, but the adhesion between insulation layer and conductor layer is insufficient
Solution Approach 1:
The conductor layer is divided into multiple sub-layers (first conductor layer, second conductor layer, third conductor layer) with different densities and functions. This segmentation allows each sub-layer to perform specific functions: the first layer provides adhesion to the insulation layer, the second layer provides electrical conductivity, and the third layer provides stress relief, thereby resolving the adhesion problem without requiring a completely new structure.
Solution Approach 2:
Different regions of the conductor layer are given different properties: the first conductor layer has high adhesion properties for bonding to insulation, the second layer has high electrical conductivity for signal transmission, and the third layer has stress relief capabilities. This local differentiation of properties allows the overall structure to achieve both strong adhesion and proper electrical function.
2Reliability
If the conductor layer is made entirely dense, then the electrical conductivity is high, but the stress relief capability is reduced
Solution Approach 1:
The conductor layer is segmented into dense regions (first and third layers) and a less dense region (second layer). The dense layers provide structural integrity and stress relief, while the less dense intermediate layer provides stress relief capability. This segmentation allows the structure to simultaneously achieve both stress relief and adequate electrical conductivity.
Solution Approach 2:
Different portions of the conductor layer have different density qualities: the first and third layers are dense for structural stability and stress management, while the second layer is less dense for stress relief. This local variation in density allows the conductor layer to provide both stress relief functionality and maintain sufficient electrical conductivity for its purpose.
3Strength
If the conductor layer has irregular contour, then the adhesion to insulation layer is improved, but the interface electrical conductivity in high-frequency regions deteriorates
Solution Approach 1:
The conductor layer is segmented into multiple sub-layers, with the first layer providing the contoured adhesion interface and the second layer providing the smooth electrical conduction path. This segmentation allows the adhesion function and electrical conduction function to be separated, so that the contour irregularities in the first layer improve adhesion without degrading the electrical conductivity in the second layer.
Solution Approach 2:
The second conductor layer acts as an intermediary between the first layer (which provides adhesion through contour irregularities) and the third layer (which provides stress relief). This intermediate layer with higher electrical conductivity ensures that the signal transmission path is not degraded by the contour irregularities of the first layer, while still allowing the first layer to adhere to the insulation layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces peeling between the insulation and conductor layers, enhances interface electrical conductivity, particularly in high-frequency regions, and maintains structural integrity under thermal stress.
Implementation Method 1
The conductor layer is constituted by a sintered body of a plurality of crystallites containing a metal as a main component
Data Source
AI summary
The wiring board includes an insulation layer made of ceramic and a conductor layer extending in a planar direction inside the insulation layer. The conductor layer is constituted by a sintered body of a plurality of crystallites containing a metal as a main component, and has a layered structure in which a dense layer, a non-dense layer, and a dense layer are layered in layers in this order in a thickness direction.