Exposed Porous Inlay Structure for Cooling Dense Component Carriers
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Solution Overview
Problem
Component carriers face challenges in managing heat dissipation, electromagnetic interference, and mechanical robustness while accommodating increasingly miniaturized and powerful electronic components with tight spacing, requiring efficient and flexible design solutions.
Innovation Solution
An inlay comprising a gas-permeable porous layer structure sandwiched between upper and lower layer structures, featuring a cavity that exposes the porous layer, providing airflow and protection, is integrated into a component carrier to enhance functionality and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are miniaturized with smaller spacing, then product functionalities and integration density increase, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The patent employs a porous layer structure within the inlay that allows gas permeability while providing mechanical support. The porous structure increases surface area for heat exchange and facilitates airflow pathways through the component carrier, enabling efficient passive cooling without compromising structural integrity or increasing component spacing.
Solution Approach 2:
The inlay combines multiple materials with complementary properties: a porous dielectric layer for heat dissipation and gas flow, a metal layer for electrical connectivity and thermal conduction, and an adhesive layer for mechanical bonding. This composite structure addresses heat management while maintaining mechanical robustness and electrical functionality in miniaturized designs.
2Productivity
If electronic components are miniaturized with smaller spacing, then integration density increases, but protection against electromagnetic interference becomes increasingly difficult
Solution Approach 1:
The patent divides the component carrier into distinct functional zones using the inlay structure. The inlay creates segmented regions with different electromagnetic properties, allowing selective shielding of sensitive areas while maintaining signal integrity in other regions. This localized approach to EMI protection is more effective than uniform shielding in miniaturized designs.
Solution Approach 2:
The inlay provides localized EMI protection precisely where needed by positioning the conductive metal layer and porous dielectric structure around specific sensitive components. This targeted approach allows different regions of the miniaturized circuit to have optimized electromagnetic characteristics without compromising overall integration density.
3Productivity
If component carriers are designed for miniaturized components, then integration density increases, but mechanical robustness decreases
Solution Approach 1:
The patent uses a thin-film inlay structure with an adhesive layer that bonds to the substrate, creating a reinforced composite panel. This thin-film approach maintains the overall miniaturized form factor while the layered composite structure and adhesive bonding provide enhanced mechanical strength and rigidity compared to a simple thin substrate.
Solution Approach 2:
The inlay combines materials with different mechanical properties: a porous dielectric layer for flexibility and adhesion, a metal layer for strength and rigidity, and an adhesive layer for bonding. This composite construction provides mechanical robustness suitable for miniaturized components while maintaining the required form factor and integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inlay structure enables effective heat dissipation, protection against moisture and electromagnetic interference, and mechanical robustness, allowing for flexible design adaptations to meet the demands of advanced electronic components.
Implementation Method 1
a gas (in particular air)-permeable porous layer structure
Data Source
AI summary
An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.