Antenna Carrier Layout for Compact Probe-Friendly Testing
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Solution Overview
Problem
The increasing demand for smaller and more integrated electronic devices poses challenges in maintaining electronic functionality, particularly in antenna design and testing, as existing packaging solutions like AiP and AoP often result in larger size and form factors.
Innovation Solution
The electronic device incorporates a carrier with a conductive element on one surface and an antenna connected to a flexible circuit structure, allowing for efficient testing and connection to external devices while minimizing obstructions, such as encapsulants, to facilitate precise electrical property measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna in package (AiP) or antenna on package (AoP) packaging solutions are used to reduce size and achieve higher integration, then integration level is improved, but device size and form factor increase
Solution Approach 1:
The patent positions the conductive element on the opposite side of the carrier from the antenna, utilizing the third dimension (depth/thickness) rather than horizontal space. This vertical separation allows both components to coexist within a compact footprint, resolving the contradiction between integration and device size by transitioning from two-dimensional planar arrangement to three-dimensional spatial arrangement.
2Reliability
If encapsulants are added to protect electronic components, then reliability is improved, but measurement precision deteriorates due to probe obstructions
Solution Approach 1:
The conductive element is extracted from the encapsulated region and positioned on the opposite side of the carrier where it remains accessible for probing. This separation allows the encapsulant to protect the antenna and electronic components without obstructing probe access to the conductive element, thereby maintaining both reliability through encapsulation and measurement precision through accessible test structures.
3Measurement precision
If multiple probes are used to test antennas with complex configurations, then measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The conductive element is designed as a universal test structure that can be probed with a single standardized probe configuration regardless of antenna type or frequency. This multi-functional test structure eliminates the need for complex, antenna-specific probe arrangements, thereby maintaining measurement accuracy while reducing device complexity and standardizing the testing process.
Data Source
AI summary
The present disclosure provides an electronic device. The electronic device includes a carrier, an electronic component, a first antenna, and a conductive element. The carrier has a first surface and a second surface opposite to the first surface. The electronic component abuts the second surface. The first antenna is connected with the carrier. The conductive element abuts the first surface of the carrier and configured to test the first antenna.