Circuit Bendability/Stretchability TRIZ Cases

A three-layer pre-package encapsulates non-planar smart card PCB components to keep surfaces planar and resist lamination deformation.

Separate rigid and flexible PCBs with an interposer to preserve fine-pitch component density while improving bend-cycle yield and flex life.

Guide slopes inside the cap let the flexible substrate bend gradually near the solder joint, preventing disconnection without special materials.

A rigid central carrier with flexible arms at different vertical levels enables compact bending while preserving strength, heat dissipation, and EMI protection.

Ground wiring that surrounds FPCB signal traces at the coupling part stabilizes RF loss and matching while preserving solder bonding access.

Sequential sensing magnets and Hall detection improve zoom position accuracy in folded imaging lens modules without increasing device size.

Adding silica particles to an elastomer insulating paste improves film formation, strength, and stretch durability for wiring substrates.

A carrier places the antenna and test conductor on opposite sides to enable precise probing in compact integrated packages.

Flexible encapsulation shields rigid electronics from temperature, pressure, humidity, salinity, and pH extremes while preserving bendability.

A compact integrated isolator layout removes partitioned board wiring to improve high-frequency impedance matching, signal isolation, and lightning protection.

Separate ground terminals linked to a conductive housing enable direct impedance measurement without extra test platforms or poor contact.

An extruded bonded coating reinforces flex-circuit mount areas to reduce wear, stress concentration, and electrical noise while preserving routing flexibility.

A detachable flexible layer on a rigid carrier enables fine conductor routing with compact geometry, high temperature resistance, and chemical stability.

Selective protective layers shield exposed stretchable wiring from water and corrosion while limiting stress concentration during repeated expansion.

Sequentially deposited liquid metal nanoclusters use oxide rupture during stretching to create new conductive paths and cut resistance.

Non-linear cutouts in a flexible battery interconnect absorb cell swelling and vibration while keeping normal width for automatic assembly.

Non-linear cutouts in a planar flexible interconnect absorb battery cell swelling while supporting precise automatic assembly and lower material waste.

A low-modulus adjustment layer around bellows-like wiring spreads strain, reducing fractures and resistance drift during repeated stretching.

Relocating the antenna from the temples to the rim and bridge lowers SAR, preserves mounting space, and maintains wireless radiation efficiency.

Patterned liquid metal in a stretchable polymer replaces conductive balls to keep anisotropic electrical connections stable under strain.

A release substrate lets printed electrodes be processed separately, avoiding heat and solvent damage to sensitive flexible device layers.

Flexible circuit bodies and an expandable holder help busbar modules absorb battery stack deformation and assembly variation.

A coaxial cable connector layout separates data and control paths to cut attenuation and stabilize mmWave antenna module communication.