Stretchable Circuit Substrate With Bellows Wiring Stress Control

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Solution Overview

Problem

The existing methods for producing stretchable circuit substrates result in uneven changes in the form of metal thin films, leading to localized stress concentration and potential fractures, as well as increased resistance values due to differences in base material extension and metal film distribution density.

Innovation Solution

A stretchable circuit substrate design incorporating a bellows-like member with ridges and recesses, an adjustment layer with a lower Young's modulus than the wiring, and a supporting base material with a higher Young's modulus, which disperses stress and maintains consistent form changes across the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the base material is expanded and then relaxed to create bellows-like shape in the metal thin film, then the stretchability of the substrate is improved, but uneven stress distribution occurs leading to localized fractures and increased resistance

Engineering Contradiction:
ImprovestretchabilityVSAvoidfracture resistance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces an adjustment layer with specifically controlled Young's modulus (smaller than the wiring but larger than the base material) positioned only in the wiring region. This creates local quality differentiation where the adjustment layer provides targeted stress distribution control in areas needing it, while leaving other regions unaffected. The layer acts as a stress buffer that prevents localized stress concentration at the metal thin film interface during stretching cycles.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If the metal thin film is made thin to maintain flexibility, then the stretchability is improved, but the resistance value increases and fracture risk increases due to insufficient stress distribution

Engineering Contradiction:
ImproveflexibilityVSAvoidresistance value stability
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The adjustment layer serves as an intermediary element between the base material and the metal thin film wiring. It mediates the stress transfer by providing a compliant interface that distributes mechanical stress uniformly across the wiring region. This prevents stress concentration that would otherwise occur at the thin metal film, thereby maintaining resistance stability and preventing fractures while preserving the flexibility enabled by the thin film structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If the base material extension is increased to improve stretchability, then the adaptability is improved, but uneven form changes occur in the metal thin film leading to stress concentration

Engineering Contradiction:
ImprovestretchabilityVSAvoiduniformity of form change
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent controls the Young's modulus parameter of the adjustment layer to be within a specific range (smaller than wiring but larger than base material). This parameter optimization enables the layer to deform in a controlled manner during stretching, ensuring uniform form changes across the wiring region. The adjusted stiffness parameter allows the layer to accommodate base material extension while maintaining uniform stress distribution, preventing localized buckling or excessive deformation of the metal thin film.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design inhibits fractures and resistance value increases by evenly distributing stress, ensuring the substrate maintains functionality and integrity during repeated stretching.

Implementation Method 1

the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring... the supporting base material has a Young's modulus larger than a Young's modulus of the base material

Methodology Applied
Scientific EffectStress distribution:

Implementation Method 2

a bellows-like member with ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentEP3709775B1Stretchable circuit substrate and article
Publication Date: 2025.07.02 DAI NIPPON PRINTING CO LTD
  • EP3709775B1 patent drawingFigure 1A~1B
  • EP3709775B1 patent drawingFigure 2A~2D
  • EP3709775B1 patent drawingFigure 3A~3D

AI summary

The present disclosure provides a stretchable circuit substrate comprising: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.