Flexible Hybrid Electronics Encapsulation for Extreme Environments
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flexible and stretchable electronics struggle to operate effectively in extreme environments due to the wide variation in conditions such as temperature, pressure, humidity, and salinity, leading to issues like damage and reduced functionality.
Innovation Solution
A system comprising an electronic assembly with encapsulation material that provides flexibility and compatibility with extreme environments, protecting the electronic components and allowing them to function in conditions ranging from -25°C to 130°C, 0 torr to 45600 torr, 20% to 100% humidity, 9 ppt to 36 ppt salinity, and pH 1 to 14, using materials like flexible glass and ceramics for encapsulation and integration strategies that include 2.5/3D architectures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid electrical components are used in electronic systems, then reliability and functionality are improved, but adaptability to extreme environments deteriorates
Solution Approach 1:
The patent applies flexible encapsulation materials including polymers, metal foils, and ceramic coatings to enclose rigid electrical components. These flexible shells protect the rigid components from extreme environmental conditions (temperature, pressure, humidity, salinity, pH) while maintaining the components' functionality. The encapsulation layer acts as a barrier between the rigid electronics and the harsh external environment, resolving the contradiction between rigidity-based reliability and environment-based adaptability.
Solution Approach 2:
The patent employs composite encapsulation structures combining multiple materials (polymers, metals, ceramics) to achieve both protection and flexibility. The composite material approach allows optimization of individual material properties - using polymers for flexibility, metals for barrier properties, and ceramics for thermal stability - thereby enabling the electronic system to maintain reliability across extreme environmental conditions.
2Adaptability or versatility
If encapsulation material with small bending radius is used, then flexibility is improved, but protection capability against environmental conditions deteriorates
Solution Approach 1:
The patent utilizes thin film encapsulation structures that can achieve small bending radii while maintaining protective functionality. The thin film design allows the encapsulation material to conform to curved surfaces and flexible substrates without compromising its barrier properties against moisture, oxygen, and other environmental harmful factors.
Solution Approach 2:
The patent employs multi-layer composite encapsulation structures where different material layers provide complementary functions. The composite structure maintains flexibility and small bending radius capability while each layer contributes specific protection against different environmental factors (e.g., polymer for flexibility, metal foil for moisture barrier, ceramic for chemical resistance).
Data Source
AI summary
Systems and methods to implement flexible hybrid electronics adaptable for extreme environments. One system includes an electronic system including at least one rigid electrical component. The electronic system may interact with an external environment having an environmental condition that satisfies an environment threshold that indicates whether the external environment is an extreme environment. The system may include an encapsulation material that encloses the electronic system. The encapsulation material may have a first material property that defines a bending radius of the encapsulation material such that the encapsulation material has a degree of flexibility that corresponds to the bending radius; and a second material property that establishes a compatibility of the encapsulation material with the external environment such that the encapsulation material prevents an adverse impact on the electronic system due to the external environment.