Antenna Substrate Coupling Structure for Pull-Out Strength
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Solution Overview
Problem
Existing coupling structures between substrates are prone to breaking when a force is applied in the direction of substrate pull-out due to low adhesion, particularly in configurations where one substrate is embedded into another.
Innovation Solution
The coupling structure includes a first substrate with a first electrode having a recess that overlaps a second electrode in the lamination direction, increasing the contact area and adhesion between the substrates, thereby enhancing the coupling strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If one substrate is embedded into another substrate for coupling, then the coupling structure is formed, but the adhesion between substrates is low and the coupling strength is insufficient when pulling force is applied
Solution Approach 1:
The invention introduces a recess in the first electrode that extends in the thickness direction (z-direction) of the flexible substrate. This vertical dimensionality change creates overlapping contact areas between the first electrode and second electrode when viewed in plan view, transforming a simple planar interface into a multi-layered contact structure that significantly enhances adhesion and coupling strength.
Solution Approach 2:
The recess in the first electrode creates a nested structure where the first electrode partially embeds into the second electrode through the recess. This nesting arrangement increases the contact area and creates mechanical interlocking between the two substrates, improving the overall coupling strength and preventing delamination under pulling forces.
2Strength
If the contact area between substrates is increased by adding a recess, then the adhesion and coupling strength are improved, but the device complexity increases
Solution Approach 1:
The recess structure is integrated directly into the first electrode pattern of the flexible substrate during the same manufacturing process, rather than being a separate component. This merging of the recess feature with the existing electrode structure minimizes additional manufacturing steps and reduces overall device complexity while achieving the desired adhesion improvement.
Data Source
AI summary
A coupling structure for coupling an antenna substrate and a rigid substrate to each other is provided. The coupling structure includes an antenna substrate and a rigid substrate. The antenna substrate includes a dielectric and an antenna electrode, and the rigid substrate includes a dielectric and a wiring electrode, the dielectric including a plurality of laminated dielectric layers. The antenna electrode is electrically coupled to the wiring electrode. The dielectric includes an upper surface and a bottom surface that are perpendicular to the lamination direction and holds the dielectric, part of the dielectric being located between the upper surface and the bottom surface. The antenna electrode has a first recess the area of which overlaps the wiring electrode in plan view in the lamination direction.