Printed Circuit Assembling TRIZ Cases

A symmetric double-sided PCB winding with core hole grooves enables automated series coil winding, cutting planar transformer complexity and cost.

Glass through holes and conductive layers form a low-loss waveguide structure that cuts attenuation, leakage, and material cost at high frequencies.

Conductive pillars and a solder ball join wafer and die contacts on orthogonal surfaces, improving coupling and manufacturing efficiency.

An embedded inductor PCB cuts layer count and repeated welding by enabling single-reflow assembly of voltage regulator modules.

LIFT-printed support and conductive layers create durable chip-to-PCB connections that avoid manual bonding limits in 3D electronics.

Embedded interposers with vertical copper pillars and lateral conductors enable dense connections while improving heat flow and carrier robustness.

Converging pad extension lines and displacement correction improve bonding alignment, reduce strain, and strengthen electrical connections.

A generic interposer pinout lets dual USB-C PD controllers from different vendors fit one PCB layout, avoiding motherboard redesign during IC shortages.

A passive battery and insulating tab disable a removed storage medium with destructive overvoltage, blocking unauthorized data access.

A sheath-protected flexible PCB inserts a waterproof pressure sensor into sealed pouch cells without damaging conductors during heat-welding.

A projecting conductive heat path helps inner-layer PCB copper dissipate heat while lowering current loss and voltage drop.

Metal flakes with an aromatic amine resin improve conductivity, substrate adhesion, and heat radiation in conductive adhesives.

A recessed substrate area confines molten solder away from bonding adhesive, preventing shorts, adhesive melting, and insulation loss.

Embedding capacitors in-line with IC solder bump interfaces cuts parasitic inductance, shortens traces, and improves signal quality.

Vision cameras and calibration equations quantify die-beam offset in laser-assisted bonding, reducing misalignment defects and stray heating.

A pull-rod connector spreads fixing force along PCB through-hole walls to reduce local stress, deformation, and nearby component damage.

An infrared reflection layer in the semiconductor package limits reflow heating at the chip, protecting data retention while keeping fast mounting.

Integrated rigid-flex PCB transmission lines replace coaxial cables to cut assembly defects, save space, and maintain low-loss high-frequency routing.

A thermistor on a separate secondary board avoids PCB heat interference, improving rear housing and battery temperature detection.

Specific Ag-Cu-Ni-Ge ranges improve wettability and shear strength while suppressing intermetallic growth and void-related defects after repeated reflow.

A bent lead plate narrows the slit-hole gap to stop molten solder flow-down while keeping circuit board connections stable and reliable.

Interchangeable outer shells tune connector impedance to match PCIE, USB, Ethernet, and SAS/SATA links for better signal integrity.

Liquid metal well arrays replace high-force socket interconnects, preserving solder-like conductivity while reducing server package area and yield loss.

An organizer holds cable connectors for accurate PCB placement, enabling separate subassembly build and reliable high-frequency interconnect assembly.

Stacked magnetic sheet parts form multiple inductors in one process, protecting coils from deformation while enabling flexible inductance tuning.

Stiffening members support a double-sided substrate to control warpage from dense die and power module mounting while preserving electrical performance.

A prefabricated metal block group spreads heat from power semiconductors through standard PCBs while preserving electrical insulation compliance.