Coating-Free Sensor Base Plate Openings by Post-Processing
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Solution Overview
Problem
Existing methods for producing components with coating-free openings are complex and time-consuming, often requiring intricate masking or machining to prevent solder from entering holes, which is inefficient and costly.
Innovation Solution
A method involving cold-forming components with initially coated openings, followed by post-processing using punching to enlarge and coat-free openings, ensuring solder-free conditions for connecting functional elements without the need for masking or deburring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If masking is used to prevent coating on openings, then coating-free openings are achieved, but the manufacturing process becomes very complex and time-consuming
Solution Approach 1:
The coating is applied to the component before the openings are created. By performing the coating operation first and then removing material to create openings, the patent eliminates the need for complex masking processes that would be required if coating were applied after opening creation. This preliminary action simplifies the overall manufacturing process while ensuring coating-free openings.
Solution Approach 2:
Instead of the conventional approach of creating openings first and then preventing coating on them through masking, the patent inverts the sequence by applying coating first and then creating openings through material removal. This inversion of the process sequence naturally results in coating-free openings without requiring any masking steps.
2Manufacturing precision
If masking is used to prevent coating on openings, then coating-free openings are achieved, but the process requires additional machining time to remove masking
Solution Approach 1:
The coating operation is performed before opening creation, eliminating the need for subsequent masking removal steps. This preliminary coating application followed by material removal approach saves significant time compared to the conventional method of masking, coating, and then removing masking.
Solution Approach 2:
The patent extracts the opening creation step from the coating process by performing material removal after coating application. This separation allows the coating to be applied uniformly to the entire component surface first, and then openings are created by removing material, automatically leaving coating-free openings without any masking or masking removal operations.
3Reliability
If coating is applied to components with openings, then solder material can flow into openings, but functional elements cannot be easily inserted and removed
Solution Approach 1:
The component has different surface properties in different regions: the outer surfaces have coating for reliable soldering, while the openings are coating-free to allow easy insertion and removal of functional elements. This local differentiation of surface quality achieves both solder connection reliability and operational ease.
Solution Approach 2:
The coating is applied before opening creation, ensuring that coating-free openings are naturally formed. This preliminary coating application followed by material removal creates the dual-function surface: coated areas for soldering and uncoated openings for element insertion/removal, without requiring post-processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for simple, cost-effective production of components with coating-free openings, preventing solder material from entering holes during soldering and enabling easy insertion and removal of functional elements, such as centering pins, while maintaining sharp edges and avoiding edge zone issues.
Implementation Method 1
the opening and/or bore, in particular the blind hole, is at least partially provided with a coating. The component is a cold-formed component in which the openings are made during the forming process. After the component has been made available and the coating has been applied, the component is processed further by enlarging the opening and/or bore, in particular the blind hole, by means of post-processing in such a way that the coating is largely completely removed
Data Source
Figure 1a~1c
Figure 2a~2c
Figure 3
AI summary
The invention relates to a method for manufacturing a component, in particular a ring-shaped and/or plate-shaped element, preferably for a device comprising sensors, in particular pressure sensors, in particular base plates for sensors, preferably pressure sensors with at least one largely coating-free opening and/or bore, comprising the following steps: - the component is provided with at least one opening and/or bore, in particular a blind hole, wherein the opening and/or bore, in particular the blind hole, is at least partially provided with a coating. - the diameter of the opening and/or bore, in particular the blind hole, is enlarged by post-processing such that the coating is largely and completely removed from the area of the opening and/or bore, in particular the blind hole, resulting in a largely coating-free opening and/or bore, in particular a blind hole.