PCB Component Embedding Using Prepreg Resin and Carrier Layers
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Solution Overview
Problem
Conventional methods for embedding electronic components in printed circuit boards result in material inhomogeneities due to differing thermal expansion coefficients, leading to cracks and reduced durability, and the resulting boards are thicker than desired for miniaturization.
Innovation Solution
A method involving temporary carrier layers to embed components using curable prepreg material, allowing resin to flow around components during curing, eliminating the need for additional layers and reducing stress, resulting in a thinner, more homogeneous board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to fix components in the printed circuit board, then components can be securely fixed, but material inhomogeneities occur due to differing thermal expansion coefficients, leading to cracks and reduced durability
Solution Approach 1:
The patent applies homogeneity by using the same prepreg material (FR4 resin system) for both the insulating layers and the component fixation. This eliminates material interfaces and ensures uniform thermal expansion coefficients throughout the board, preventing crack formation while maintaining secure component fixation.
Solution Approach 2:
The patent merges the functions of insulating layers and component fixation by using the same prepreg material for both purposes. The prepreg serves dual roles: as the insulating layer between conducting layers and as the adhesive matrix that fixes components, eliminating the need for separate adhesive materials.
2Ease of manufacture
If clearances are created and components are inserted and glued, then components can be embedded, but additional adhesive layers increase board thickness
Solution Approach 1:
The patent combines the insulating layer and fixation medium into a single prepreg material layer. This eliminates the need for separate adhesive layers that would increase thickness, as the prepreg itself serves as both the insulating barrier and the component fixation matrix.
Solution Approach 2:
The patent applies local quality by creating clearances in the prepreg material specifically for component insertion, while the surrounding areas maintain the insulating structure. This allows precise component placement without requiring additional layers throughout the entire board, minimizing thickness increase.
3Reliability
If multiple prepreg layers are used to cover clearances and components, then components are securely embedded, but the printed circuit board becomes thicker
Solution Approach 1:
The patent merges multiple functions into a single prepreg layer: insulation, component fixation, and structural support. This eliminates the need for multiple separate prepreg layers that would be required in conventional methods, achieving secure embedding without increased thickness.
Solution Approach 2:
The prepreg material exhibits multi-functionality by simultaneously serving as the insulating layer, the adhesive matrix for component fixation, and the structural support material. This universal application of a single material system eliminates the need for additional layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces thin, durable printed circuit boards with minimal thermal stress and improved mechanical stability, suitable for miniaturized electronic devices.
Implementation Method 1
the resin of the prepreg material is in a non-cured state, which is referred to as the B-stage. B-stage prepregs are stored on rollers while being cooled so as to prevent premature curing of the resin
Implementation Method 2
the clearances or openings comprising the components to be covered with further B-stage prepreg layers, and optionally with further contact layers or electrically conducting layers. This combination is subsequently compressed to yield the finished printed circuit board
Implementation Method 3
the first temporary carrier layer and the second temporary carrier layer are removed from the printed circuit board
Data Source
AI summary
A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps:providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material;creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination;positioning the component to be embedded in the clearance by way of the first temporary carrier layer;covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer;compressing the combination with the component, curing the curable prepreg material; andremoving the temporary carrier layers.