Embedded Interposer Component Carrier for Dense Routing and Heat Flow
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Solution Overview
Problem
Existing component carriers face challenges in efficiently forming electric connections while maintaining mechanical robustness and electrical reliability, particularly under harsh conditions, and there is a need to manage heat generated by miniaturized and densely packed electronic components.
Innovation Solution
A component carrier design incorporating a stack with embedded interposers featuring vertically extending copper pillars and lateral electrically conductive structures, allowing for high-density connections where needed and simpler connections elsewhere, along with a chip-last manufacturing architecture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If miniaturization of electronic components and increased component density are implemented, then product functionality and integration density are improved, but heat generation increases and becomes difficult to manage
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by embedding interposers vertically within the component carrier stack. This vertical integration allows heat to be conducted away through the thickness direction of the carrier, providing an additional thermal management dimension beyond traditional surface-level cooling methods.
Solution Approach 2:
The embedded interposers act as thermal intermediaries between the densely packed components and the heat sink structures. These interposers conduct heat laterally from high-density component regions and transfer it to dedicated heat dissipation pathways, mediating the thermal management challenge created by miniaturization.
2Reliability
If embedded interposers with vertically extending conductive structures are used, then electric connection efficiency and integration density are improved, but manufacturing complexity increases
Solution Approach 1:
The component carrier is segmented into functional zones: regions with embedded interposers for high-density connections and regions with conventional lateral conductive structures for simpler connections. This segmentation allows different manufacturing approaches to be applied optimally in different areas, reducing overall manufacturing complexity while maintaining high connection efficiency where needed.
Solution Approach 2:
The patent applies different structural qualities to different locations within the component carrier. High-density vertical interposer structures are placed only where complex electrical interconnections are required, while other areas use simpler lateral conductive paths. This local differentiation optimizes electric connection efficiency without unnecessarily increasing manufacturing complexity across the entire carrier.
3Reliability
If high-density vertical connections are implemented through interposers, then electric connection efficiency is improved, but mechanical robustness under harsh conditions deteriorates
Solution Approach 1:
The patent merges the functions of electrical interconnection and mechanical reinforcement by embedding interposers that provide both vertical electrical pathways and structural support. The interposer structures serve dual purposes: enabling high-density electrical connections and acting as mechanical anchors that enhance the overall robustness of the component carrier assembly under harsh conditions.
Data Source
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AI summary
A component carrier (100) and a method of manufacturing a component carrier (100), the component carrier comprises a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), an interposer (108) having a plurality of vertically extending electrically conductive through connections (110) and being embedded in the stack (102), and electrically conductive structures (112) in the stack (102) laterally on both sides of the interposer (108).