Silicon Carbide Module Heat Sink Bonding With High-Conductivity Solder

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Solution Overview

Problem

Conventional heat dissipation creams for semiconductor components exhibit low thermal conductivity and poor heat transfer efficiency, failing to meet the high thermal demands of highly integrated electronic products.

Innovation Solution

A silicon carbide module is integrated with a heat sink using solder paste, which is welded at a low temperature (130° C. to 140° C.) to enhance heat conduction, utilizing solder paste with high thermal conductivity (K > 40) to improve heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional heat dissipation cream is used to attach the heat sink to the silicon carbide module, then the assembly process is simple, but the thermal conductivity is low (K=2.5) and heat transfer efficiency is poor

Engineering Contradiction:

Improveassembly simplicityVSAvoidheat transfer efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material parameter from conventional heat dissipation cream to solder paste, which fundamentally alters the thermal conductivity parameter from K=2.5 to K>40, thereby resolving the contradiction between assembly simplicity and heat transfer efficiency

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses solder paste as a composite material that combines the benefits of thermal conductivity (K>40) with adhesive properties, enabling both effective heat transfer and reliable mechanical bonding between the heat sink and silicon carbide module

Inventive Principle:

Principle #40Composite materials

2Reliability

If the contact area between the silicon carbide module and heat sink is increased, then heat dissipation efficiency improves, but the actual contact area is limited by surface defects and air gaps with high thermal resistance

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal resistance from air gaps

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces solder paste as an intermediary material that fills the gaps and defects between the heat sink and silicon carbide module, eliminating air pockets with high thermal resistance and creating continuous thermal pathways, thus improving heat dissipation efficiency

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solder paste's paste structure allows it to penetrate and fill microscopic pores and defects on the contact surfaces, ensuring maximum contact area and eliminating thermal resistance barriers caused by surface imperfections

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively transfers heat from the silicon carbide module to the heat sink, reducing the module's temperature and enhancing overall heat dissipation efficiency.

Implementation Method 1

solder paste with high thermal conductivity (K > 40) to improve heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

welded at a low temperature (130° C. to 140° C.) to enhance heat conduction

Methodology Applied

Scientific EffectMelting: Melting

Data Source

PatentUS12484158B2Method for forming silicon carbide module integrated structure

Publication Date: 2025.11.25 ZEROVA TECH TAIWAN LTD

AI summary

A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.